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Polyamide resin and polyamide composition composed of same

A technology of polyamide composition and polyamide resin, which is applied in the field of polyamide resin and polyamide composition composed of it, can solve the problems of resin degradation and limit the application of polyamide resin, and achieve the effect of high fluidity

Inactive Publication Date: 2014-03-19
KINGFA SCI & TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned operation means inevitably bring about the problem of resin degradation, which limits the application of polyamide resin in many fields

Method used

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  • Polyamide resin and polyamide composition composed of same
  • Polyamide resin and polyamide composition composed of same
  • Polyamide resin and polyamide composition composed of same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment A1~A15

[0065] Embodiment A1~A15 (preparation of polyamide resin A) and comparative example 1~4:

[0066] In the autoclave equipped with magnetic coupling stirring, condenser, gas phase port, feeding port, and pressure explosion-proof port, add the reaction raw materials according to the ratio in Table 1, then add sodium hypophosphite and deionized water; the weight of sodium hypophosphite is deionized 0.1% of the weight of other feeds except water, and 30% of the total weight of deionized water; vacuumize and fill high-purity nitrogen as a protective gas, and heat up to 220 within 2 hours under stirring o C, the reaction mixture was heated at 220 o C was stirred for 1 hour, and then the temperature of the reactant was raised to 230 o C; response at 230 o The constant temperature of C and the constant pressure of 2.2Mpa continued for 2 hours, and the pressure was kept constant by removing the formed water. After the reaction was completed, the prepolymer was discharged at 80 o C ...

Embodiment B1~B10

[0071] Embodiment B1~B10: the preparation of polyamide resin B

[0072] In the autoclave equipped with magnetic coupling stirring, condensing tube, gas phase port, feeding port, and pressure explosion-proof port, add the reaction raw materials according to the ratio in Table 2, then add sodium hypophosphite and deionized water; the weight of sodium hypophosphite is deionized 0.1% of the weight of other feeds except water, and 30% of the total weight of deionized water; vacuumize and fill high-purity nitrogen as a protective gas, and heat up to 220 within 2 hours under stirring o C, the reaction mixture was heated at 220 o C was stirred for 1 hour, and then the temperature of the reactant was raised to 230 o c. response at 230 o The constant temperature of C and the constant pressure of 2.2Mpa continued for 2 hours, and the pressure was kept constant by removing the formed water. After the reaction was completed, the prepolymer was discharged at 80 o C under vacuum drying...

Embodiment C1~C9 and comparative example 5~10

[0075] Embodiment C1~C9 and comparative example 5~10: the preparation of polyamide composition

[0076] Mix polyamide resin A, polyamide resin B, titanium dioxide, talcum powder, and other additives uniformly in the high-mixer according to the formula in Table 3, and then add them into the twin-screw extruder through the main feeding port, and the reinforcing filler passes through Side feeding by side feeding scale, extrusion, water cooling, granulation and drying to obtain the polyamide composition; wherein, the extrusion temperature is 330 o c.

[0077] table 3

[0078]

[0079] Continued Table 3

[0080]

[0081] As can be seen from Examples A1 to A15, Comparative Examples 1 to 4 and Examples B1 to B10, along with the increase of the amount of multifunctional compound added, the relative viscosity of the polyamide resin A obtained first decreases and then increases; when the multifunctional compound When the addition amount of the polyfunctional compound is 0, a ...

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Abstract

The invention discloses a polyamide resin A which has a relative viscosity of 1.2-1.8 in 98% concentrated sulfuric acid at 25 DEG C; the polyamide resin A has an amino end group value of 20-60 mol / t, and a carboxyl end group value of 70-130 mol / t; in the polyamide resin A, the proportion of benzoic acid in repetitive units is 2-6 mol%; the polyamide resin A is polymerized by adding polyfunctional compounds during the polymerization process; the adding amount of the polyfunctional compounds is 0.1-1 mol%. The polyamide composition comprises the following components: 31-99 wt% of polyamide resin A; 0-68 wt% of polyamide resin B; 0.8-40 wt% of mineral fillers; and 0.2-1 wt% of other additives. The polyamide resin A of the invention has low apparent viscosity under fusion conditions, has high fluidity; when a certain ratio of polyamide resin A is added into semi-aromatic polyamide, the prepared polyamide composition has high fluidity and comparable mechanical properties, and is applicable to conditions with high injection molding product dimension requirements.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a polyamide resin and a polyamide composition composed of it. Background technique [0002] Polyamide is widely used because of its good comprehensive properties, including mechanical properties, heat resistance, wear resistance, chemical resistance and self-lubrication, low coefficient of friction, certain flame retardancy, and easy processing. It is suitable for filling and modifying with glass fiber and other fillers to improve performance and expand application range. In recent years, semi-aromatic polyamides have been focused on development due to their better heat resistance and mechanical properties. [0003] Polyamide resin polymerized from decanediamine and terephthalic acid has low water absorption and high melting point, and is currently developing rapidly. However, the melt viscosity of polyamide resin is higher compared to PA6T polyamide resin. When it is necessar...

Claims

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Application Information

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IPC IPC(8): C08G69/26C08L77/06C08K13/02C08K3/22C08K3/34
Inventor 张传辉刘奇祥蔡彤旻曾祥斌曹民吉继亮夏世勇
Owner KINGFA SCI & TECH CO LTD
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