Pre-cleaning agent for silicon wafer

Abstract

The invention discloses a pre-cleaning agent for a silicon wafer. The pre-cleaning agent comprises components in parts by weight as follows: 15-20 parts of a surface active agent, 25-40 parts of nitric acid, 2-5 parts of triethanolamine, 2 parts of citric acid, 1 part of hydrofluoric acid, 2 parts of hydrogen peroxide and the balance of deionized water. The obtained pre-cleaning agent for the silicon wafer integrates characteristics of an organic cleaning agent and an inorganic cleaning agent, and can effectively remove various pollutants on the surface of the silicon wafer, and a good condition is created for a texturing technology of the silicon wafer, so that the merit factor and efficiency of a solar cell are improved.

Description

technical field [0001] The invention relates to a cleaning agent, especially a silicon chip pre-cleaning agent. Background technique [0002] Usually, there will be various pollutants on the surface of the silicon wafer, that is, the surface contamination of the silicon wafer, including particles, metals, organic matter, moisture molecules and natural oxides deposited on the silicon surface. These pollutants are formed when silicon rods are cut into silicon wafers, due to the metal particles and silicon particles produced by the abrasion of the cutting line and silicon wafers, and the residues of auxiliary agents and adhesives used in the cutting process. In addition, during the storage and transportation of silicon wafers, because the pollutants remain on the surface of the silicon wafer for too long, the pollutants are oxidized, and the oxidized pollutants are strongly adsorbed on the surface of the silicon wafers, which cannot be thoroughly cleaned by the current cleaning...

AI Technical Summary

Problems solved by technology

In addition, during the storage and transportation of silicon wafers, because the pollutants remain on the surface of silicon wafers for too long, the pollutants are oxidized, and the oxidized pollutants are strongly adsorbed on the surface of silicon wafers, which cannot be thoroughly cleaned by current cleaning methods.

The existence of these pollutants will affect the later processing technology, so that there are too many residual compounds, metal pollutants and acid and alkali residues on the surface of the silicon wafer during texturing, causing white spots on the surface of the silicon wafer, resulting in chromatic aberration, and reducing the conversion of solar cells. Efficiency, affecting yield and product quality