Micromechanical chip test probe card and manufacturing method thereof

Abstract

Provided are a micromechanical chip test probe card and a method of fabricating same. A cantilever beam pattern (20) is defined in an SOI substrate. A blind hole (105) whose inner wall is insulated is fabricated on a floating end (201) of a cantilever beam. A probe (107) is fabricated in the blind hole (105). A metal lead (108) is fabricated on the surface of the cantilever beam. A solder ball (112) is fabricated on the fixed end (202) of the cantilever beam. SOI is etched on the front surface to form a cantilever beam structure. The solder ball (112) is inversely installed in a ceramic substrate (114). A silicon substrate (101) is etched from the bottom surface to release the cantilever beam and complete the preparation. The advantages of the micromechanical chip test probe card and the method of fabricating same are as follows: the processing precision is high; the processing technique is simple; the mechanical strength of the fabricated test probe card is high; probes can be arranged based on the pin position distribution of a chip to be tested. The fabricating technique is compatible with a conventional CMOS technique and a micromachining technique and is suitable for industrial production.

Description

technical field [0001] The invention belongs to the field of micro-machining, and in particular relates to a micro-mechanical chip test probe card and a manufacturing method thereof. Background technique [0002] Integrated circuit wafer-level test probes are mainly used for mid-test and KGD testing of the electrical properties of integrated circuit chips before chip packaging. The test of integrated circuit chip is realized by automatic tester (AutomaticTestEquipment). The automatic tester includes a test bench, a probe card, a test data analyzer, and an interface device between the analyzer and the probe card, among which the probe card is its core component. Traditional probe cards include epoxy resin type, blade type, vertical type, array type, micro-spring type and other types, and their production process is mostly manual assembly. As the line width of integrated circuits continues to shrink and the size and density of bonding pads continue to increase, manual assemb...

AI Technical Summary

Problems solved by technology

[0006] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a micromechanical chip test probe card and its manufacturing method, which are used to solve the complex manufacturing process, high difficulty of photolithography, low structural strength and easy lead to device failure and other problems

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