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Photosensitive resin composition, cured product and spacer

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, cured product and spacer, which can solve the problems of lower contrast of liquid crystal panel, lower substrate adhesion, light leakage, etc., and achieve excellent elastic recovery characteristics and tightness Synergistic effect

Active Publication Date: 2014-03-26
SANYO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these beads are randomly dispersed, so there is a problem that the beads are distributed on the color-developing pixels, thereby causing light leakage, scattering of incident light, etc., and lowering the contrast of the liquid crystal panel
[0008] However, no matter which method, the adhesiveness between the spacer and substrates such as glass is reduced, so a photosensitive resin composition for forming a photo-spacer capable of both high elasticity and sufficient adhesiveness has not yet been obtained.

Method used

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  • Photosensitive resin composition, cured product and spacer
  • Photosensitive resin composition, cured product and spacer
  • Photosensitive resin composition, cured product and spacer

Examples

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Embodiment

[0148] Hereinafter, the present invention will be further described by way of examples and comparative examples, but the present invention is not limited to these examples. Hereinafter, unless otherwise specified, % means % by weight, and part means parts by weight.

[0149] [Manufacture of hydrophilic resin]

manufacture example 1

[0151] A cresol novolac epoxy resin "EOCN-102S" (manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent of 200) 200 parts and 245 parts of propylene glycol monomethyl ether acetate were heated to 110° C. and dissolved uniformly. Next, 76 parts (1.07 mol parts) of acrylic acid, 2 parts of triphenylphosphine, and 0.2 part of p-methoxyphenol were injected|thrown-in, and it was made to react at 110 degreeC for 10 hours. Further, 91 parts (0.60 mole parts) of tetrahydrophthalic anhydride were dropped into the reactant, and then reacted at 90°C for 5 hours, and then diluted with propylene glycol monomethyl ether acetate so that the content of the hydrophilic epoxy resin was 50% by weight, as a hydrophilic resin having an acryloyl group and a carboxyl group, a 50% solution (A-1) of a cresol novolac epoxy resin containing an acryloyl group and a carboxyl group was obtained.

[0152] In addition, in terms of pure components, the number average molecular weight (Mn) of this resin me...

manufacture example 2

[0154]In the same flask as Manufacturing Example 1, drop into 200 parts of cresol novolak epoxy resin "EOCN-102S" (manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent is 200) and 200 parts of propylene glycol monomethyl ether acetate, Heat to 110°C and dissolve evenly. Afterwards, utilize propylene glycol monomethyl ether acetate to dilute so that the hydrophilic epoxy resin content is 50% by weight, have obtained the 50% solution (A- 2).

[0155] It should be noted that, in terms of pure components, the Mn of this resin is 1800, the SP value is 11.7, and the HLB value is 6.4.

[0156] [Production of a siloxane compound (E-3) having two or more hydrolyzable alkoxy groups]

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Abstract

The purpose of the present invention is to provide a photosensitive resin composition which has a good balance between elastic modulus recovery and adhesion and is capable of forming a fine spacer. The photosensitive resin composition of the present invention is an alkali-developable photosensitive resin composition which is characterized by containing, as essential ingredients, (A) a hydrophilic resin, (B) a multifunctional (meth)acrylate, (C) a radical trapping agent, (D) a photopolymerization initiator and (E) a metal element-containing compound. The alkali-developable photosensitive resin composition is also characterized in that the energy difference between the lowest unoccupied molecular orbital of the component (C) and the highest occupied molecular orbital of the component (D) is 11.5 eV or less.

Description

technical field [0001] The present invention relates to a photosensitive resin composition suitable for forming a spacer, and a cured product and a spacer formed from the composition. Background technique [0002] In recent years, liquid crystal display devices have attracted much attention, and a large amount of photosensitive resins have been used in their manufacturing process. For example, a photosensitive resin in which a coloring pigment is dispersed is used for a portion corresponding to a pixel on a color filter, and a photosensitive resin is also used for a black matrix. [0003] Conventionally, in a liquid crystal display panel, beads having a predetermined particle diameter are used as spacers to provide a space between two substrates. However, these beads are randomly dispersed, so there is a problem that the beads are distributed on the color-developing pixels, thereby causing light leakage, scattering of incident light, etc., and lowering the contrast of the l...

Claims

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Application Information

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IPC IPC(8): G03F7/075G03F7/004G03F7/027G02F1/1339
CPCG03F7/028G02F1/1339G03F7/0757G03F7/075G03F7/0047G02F1/13394G03F7/40G03F7/027G02F2001/13398G03F7/004G03F7/031G02F1/13398
Inventor 田边史行山下真友子山下泰治
Owner SANYO CHEM IND LTD
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