Polycrystalline silicon chip cutting method capable of saving steel wire

Abstract

The invention discloses a polycrystalline silicon chip cutting method capable of saving a steel wire. A cutting steel wire is coiled in from a wire inlet guide wheel and coiled out from a wire outlet guide wheel through a front pulley after being released from a wire releasing wheel and is coiled on a wire retracting wheel through a rear pulley, an electric appliance control system comprises the wire releasing wheel, the wire inlet guide wheel, the wire outlet guide wheel and the wire retracting wheel, a steel wire transmission mechanism drives the cutting steel wire to do high-speed forward and reverse interval alternating linear motion so as to cut a polycrystalline silicon ingot, and the rotating directions of the wire releasing wheel, the wire inlet guide wheel, the wire outlet guide wheel and the wire retracting wheel can be alternately controlled by the electric appliance control system during a cutting process. The steel wire transmission mechanism is driven to rotate in 0.55-0.65 unit time according to an anticlockwise direction by the electric appliance control system after the steel wire transmission mechanism rotates in a unit time according to a clockwise direction, the rotation can be recurrently carried out in such a way, not only can the using amount of the cutting steel wire be reduced, but also the cutting action of silicon carbide cutting particles in mortar can be fully utilized, thus the using amount of the mortar is saved, and the processing cost of a polycrystalline silicon chip is reduced.

Description

technical field [0001] The invention relates to a processing technology of a polycrystalline silicon wafer, in particular to a cutting process of a solar polycrystalline silicon wafer. Background technique [0002] Solar polysilicon wafers are the most important raw materials for solar cells. A common production method for polysilicon wafers is multi-wire cutting. Multi-wire cutting is accomplished by a slicer. The slicer is equipped with a pulley block, a pay-off wheel, a wire guide wheel and a wire take-up wheel. The winding wheel drives the cutting steel wire to move in a straight line at a constant speed. When the cutting steel wire moves rapidly, it carries the mortar flowing down from the mortar curtain to grind and cut the ingot, thereby cutting the ingot into silicon wafers. In the existing cutting technology, the cutting steel wire adopts a one-way cutting method, that is, the steel wire enters the wire from the head of the guide pulley through the pulley block fr...

AI Technical Summary

Problems solved by technology

In the existing cutting technology, the cutting steel wire adopts a one-way cutting method, that is, the steel wire enters the wire from the head of the guide pulley through the pulley block from the pay-off pulley, exits from the tail of the guide pulley, enters the pulley block, and is wound on the take-up wire. On the reel, the cutting steel wire enters in a single direction, and the cutting steel wire on the take-up wheel will not be reused after cutting, so the cost of cutting steel wire is relatively high

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