Near-solidus rolling method of foil-shaped liquid metal

Abstract

The invention discloses a near-solidus rolling method of foil-shaped liquid metal. The near-solidus rolling method comprises (1) rough rolling: feeding an alloy casting into a rough rolling machine, enabling the reduction rolling pass of the rough rolling after lubrication to be 1mm-0.8mm-0.6mm-0.4mm, and controlling temperature to be 10 DEG C higher than solidus temperature of the material; (2) intermediate rolling: after lubrication of rolling oil, enabling the reduction rolling pass of the intermediate rolling to be 0.4mm-0.2mm-0.10mm, and controlling temperature to be 8 DEG C higher than solidus temperature of the material; (3) raw material cleaning: utilizing acetone to clean alloy foil; (4 ) finish rolling: feeding the foil into a finish rolling machine, enabling the reduction rolling pass of the finish rolling to be 0.1mm-0.08mm-0.06mm-0.04mm, and controlling temperature to be 4 DEG C higher than solidus temperature of the material. By means of the near-solidus rolling method, multiphase liquid metal serves as the raw material, problems of processing brittleness and low yield of materials are effectively reduced, plasticity of materials is recovered, and resistance to deformation is improved. Products are unlikely to break off, frequency of needle-shaped holes is greatly reduced, ductility of the foil-shaped liquid metal is high during machining, and mechanical property and quality of the foil-shaped liquid metal are not affected.

Description

technical field [0001] The invention relates to the rolling technology of foil-like liquid metal, in particular to a near-solidus rolling method of foil-like liquid metal. Background technique [0002] With the increase of circuit integration and power, as well as the continuous shrinkage of volume, the heat flux generated by the chip has also increased significantly, and the temperature of electronic equipment has also increased rapidly. Electronic equipment failures caused by heat dissipation problems are also increasing. Effectively solving the heat dissipation problem of electronic devices has become a key technology that needs to be solved urgently in the development process of the entire information industry. With the rapid increase of computer chip integration, the required heat transfer intensity is getting higher and higher. Metals have much higher thermal conductivity than non-metals, so the use of liquid metals as thermal interface materials will greatly improve...

AI Technical Summary

Problems solved by technology

The existence of these components makes the foil liquid metal thermal interface material have low elongation rate during the molding process, poor mechanical properties, easy to crack, and low product yield.