Preparation method of heat-dissipating acrylic adhesive tape

Abstract

The invention discloses a preparation method of a heat radiation type acrylate adhesive tape. The preparation method comprises the steps: uniformly mixing 0.2-0.5 part of crosslinking agent, 70-135 parts of methylbenzene, 50-85 parts of ethyl acetate and 50-70 parts of butanone to obtain a dilution; uniformly mixing 55-100 parts of graphite powder and the dilution in the first step; mixing 100 parts of acrylate adhesive and the mixed solution in the second step, dispersing for 2-10h by using a high-speed agitator, and furthermore, uniformly mixing to form a heat-conductive adhesive mixed solvent; adding 0.4-0.6 part of coupling agent into an adhesive and stirring for 0.5-1h; coating the heat-conductive adhesive mixed solvent in the third step on the lower surface of a PET (Polyethylene Terephthalate) film, wherein the upper surface of the PET film is provided with an aluminum foil layer; roasting the heat-conductive adhesive mixed solvent in the fourth step to form a heat-conductive adhesive layer; and gluing a release material on the other surface of the roasted heat-conductive adhesive layer in the fifth step. By using the preparation method, the heat conductivity is greatly improved on the aspects of length and thickness, and the technical defect of great viscosity increment of the adhesive layer during long-term heat conductivity is overcome.

Description

technical field [0001] The invention relates to a preparation method of a heat-dissipating acrylic adhesive tape, which belongs to the technical field of adhesive materials. Background technique [0002] With the rapid development of the electronics industry, from ordinary desktop computers to notebook computers, tablet computers, and smart phones, technological innovation is advancing by leaps and bounds. Electronic products are becoming more portable, smaller in size, and more powerful in function, which leads to higher integration. This leads to shrinking volume and stronger functions, which directly leads to higher and higher heat dissipation requirements of electronic components. However, the fan-type heat dissipation used in the past was gradually eliminated by the market due to its large size and noise. Then there are other heat dissipation materials, such as copper foil and aluminum foil, but due to limited resources and high prices, the heat dissipation effect is ...

AI Technical Summary

Problems solved by technology

This leads to shrinking volume and stronger functions, which directly leads to higher and higher heat dissipation requirements of electronic components.

However, the fan type heat dissipation used in the past was gradually eliminated by the market due to its large size and noise.

In turn, other heat dissipation materials have been produced, such as copper foil and aluminum foil heat dissipation. However, due to limited resources and high prices, the heat dissipation effect is not as good as imagined. Slowly, they are all looking for new and efficient heat dissipation materials.

Secondly, due to the diversity of electronic products, existing products often need to be customized, which makes it difficult to apply to specific use occasions and limits its application promotion; therefore, if a high-performance heat dissipation tape is designed for the characteristics of electronic products, it will become The direction of efforts of those of ordinary skill in the art

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