Back contact structure of cadmium telluride thin-film solar cell, solar cell, cell assembly, and preparation method
A thin-film solar cell, back-contact structure technology, applied in electrical components, circuits, photovoltaic power generation, etc., can solve problems such as high resistivity and unsatisfactory batteries, and achieve the effect of reducing manufacturing costs
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Embodiment 1
[0024] The back contact structure of the present invention is 0.5Mo 2 N-0.5MoO 2 battery.
[0025] Preparation method and conditions: 120nm thickness prepared by magnetron sputtering, Ar / O2 / N2=0.95 / 0.02 / 0.03, sputtering pressure 2.5Pa, substrate temperature 150 degrees, sputtering power 200W.
[0026] After sputtering 0.5Mo 2 N-0.5MoO 2 Post-layer annealing, the annealing temperature is 200 degrees, and the annealing time is 40 minutes.
[0027] according to figure 1 As shown, the J-V test results are as follows, the efficiency can reach 11.556%, the open circuit voltage is 775mV, the fill factor is 0.66, and the short circuit current is 22.48mA / cm 2 .
Embodiment 2
[0034] The back contact junction is Cu / 0.5Mo 2 N-0.5MoO 2 battery.
[0035] Preparation conditions:
[0036] Cu layer: 5nm prepared by magnetron sputtering, sputtering pressure: 2.4Pa, substrate temperature: room temperature, power: 100w (round target with a diameter of 110mm).
[0037] 0.5Mo 2 N-0.5MoO 2 Layer: 120nm thick prepared by magnetron sputtering, Ar / O2 / N2=0.95 / 0.02 / 0.03, sputtering pressure is 2.5Pa, substrate temperature is 150 degrees, sputtering power is 200W.
[0038] After sputtering 0.5Mo 2 N-0.5MoO 2 Post-layer annealing, the annealing temperature is 200 degrees, and the annealing time is 40 minutes.
[0039] according to image 3 As shown, the J-V test results are as follows, the efficiency can reach 13.15%, the open circuit voltage is 786mV, the fill factor is 0.67, and the short circuit current is 23.97mA / cm 2 .
[0040] Comparative example:
[0041] The back contact structure is Cu / Mo 2 N battery.
[0042] Preparation conditions:
[0043] C...
Embodiment 3
[0049] A cell with a back contact junction of 0.7MoN-0.3MoO3.
[0050] Preparation method and conditions: 120nm thickness prepared by magnetron sputtering, Ar / O2 / N2=0.94 / 0.04 / 0.02, sputtering pressure 2.5Pa, substrate temperature 150 degrees, sputtering power 200W.
[0051] After sputtering 0.7MoN-0.3MoO 3 After layer annealing, the annealing temperature is 220 degrees
[0052] according to Figure 5 As shown, the J-V test results are as follows, the efficiency can reach 10.834%, the open circuit voltage is 789mV, the fill factor is 0.615, and the short circuit current is 22.3mA / cm 2 .
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