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A kind of screen printing waterproof adhesive for thin film circuit and preparation method thereof

A technology of screen printing and thin film circuit, which is applied in the field of electronic paste, can solve the problems of affecting the service life of thin film circuit, the decrease of the adhesion force of waterproof adhesive, and the deterioration of the transparency of waterproof adhesive, so as to achieve superior printing performance, increase service life, Easy to apply repeatedly

Active Publication Date: 2015-09-09
SUZHOU BETELY POLYMER MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to ensure the printing performance of existing film circuit waterproof adhesives, a large amount of defoaming agent needs to be added during the production process, resulting in poor transparency of the waterproof adhesive. At the same time, most of the defoaming agents are silicone-based. During the baking process, the defoamer will float on the surface of the colloid with the volatilization of the solvent, which will lead to a decrease in the adhesion of the waterproof adhesive, which cannot meet the waterproof requirements and affect the service life of the thin film circuit.

Method used

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  • A kind of screen printing waterproof adhesive for thin film circuit and preparation method thereof
  • A kind of screen printing waterproof adhesive for thin film circuit and preparation method thereof
  • A kind of screen printing waterproof adhesive for thin film circuit and preparation method thereof

Examples

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Effect test

Embodiment 1

[0030] The preparation method of screen printing waterproof glue in this embodiment is as follows:

[0031] (1) Add 14 kg of commercially available high carboxyl value and low hydroxyl value acrylic resin pressure-sensitive adhesive (brand SH-602, product of Jiangyin Shuanghua Technology Co., Ltd.) and 1.2 kg of ethylene glycol monobutyl ether acetate into a three-necked flask, heat Stir and distill to remove about 1.8kg of the fraction below 155°C in the system, change to condensing and reflux, control the temperature at 150-160°C, add 58g of organic peroxide 1,1-bis-(tert-butyl peroxy)-3,3, 5-Trimethylcyclohexane was diluted to 50wt% with ethylene glycol monobutyl ether acetate, slowly added dropwise to the above system, and the dropping speed was controlled to be 2 seconds / drop. The obtained solid content is 56.8%, and the obtained modified low molecular weight acrylic resin 1 is adjusted to 50% with ethylene glycol monobutyl ether acetate, and adopts a BROOKFIELD viscomete...

Embodiment 2

[0037] (1) Add 14kg of commercially available high carboxyl value and low hydroxyl value acrylic resin pressure-sensitive adhesive (brand SH-602 Jiangyin Shuanghua Technology Co., Ltd.) and 1.2kg of ethylene glycol monobutyl ether acetate into a three-necked flask, heat, stir and distill Remove about 1.8kg of the fraction below 155°C in the system, change to condensing and reflux, control the temperature at 150-160°C, and add 58g of organic peroxide 1,1-bis-(tert-butyl peroxy)-3,3,5- Trimethylcyclohexane was diluted to 50wt% with ethylene glycol monobutyl ether acetate, slowly added dropwise to the above-mentioned system, and the rate of addition was controlled to be 2 seconds / drop. The obtained modified low-molecular-weight acrylic resin 1 is adjusted to 50% with ethylene glycol monobutyl ether acetate, and the BROOKFIELD viscometer is used to measure the viscosity at 20 revolutions using No. 14 rotor to measure the viscosity It is 5500mpa.s.

[0038](2) Add 24kg of commerci...

Embodiment 3

[0043] (1) Add 14 kg of commercially available high carboxyl value and low hydroxyl value acrylic resin pressure-sensitive adhesive (brand CF-2, Weifang Fule New Material Co., Ltd.) and 1.2 kg of ethylene glycol monobutyl ether acetate into a three-necked flask, heat Stir and distill to remove about 1.8kg of the fraction below 155°C in the system, change to condensing and reflux, control the temperature at 150-160°C, add 62g of organic peroxide 1,1-bis-(tert-butyl peroxy)-3,3, 5-Trimethylcyclohexane was diluted to 50wt% with ethylene glycol monobutyl ether acetate, slowly added dropwise to the above system, and the dropping speed was controlled to be 2 seconds / drop. The obtained solid content is 57.4%, and the gained modified low molecular weight acrylic resin 1 is adjusted to 50% with ethylene glycol monobutyl ether acetate, adopts BROOKFIELD viscometer, uses No. 14 spindles to measure the viscosity when 20 turns, measure The resulting viscosity is 5875mpa.s.

[0044] (2) Ad...

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Abstract

The invention discloses a silk-screen printing waterproof adhesive for thin-film circuit and a preparation method thereof. The waterproof adhesive is prepared by mixing modified acrylate resin polymers (1 and 2) of low molecular weight and different degrees of functionality obtained by performing organic peroxide cracking on commercially available acrylic resins of different degrees of functionality with a leveling agent and a solvent at a specific ratio; during use, the waterproof adhesive can be coated to thin-film circuits made of PET, PE and PP through silk-screen printing by matching with corresponding curing agents, and the aims of resisting water, insulating moisture and protecting the circuit are achieved. According to the waterproof adhesive, a defoaming agent is not needed, the waterproof adhesive has the advantages of excellent printing performance, long construction time, high adhesive force, high-temperature and humidity resistance, creep resistance, simplicity in repeated attachment and excellent waterproof performance and has wide market application prospects, and the service life of the thin-film circuit is greatly prolonged.

Description

technical field [0001] The invention belongs to the field of electronic paste, and in particular relates to a screen printing waterproof glue applied to thin film circuits. Background technique [0002] Thin film circuit is a flexible circuit board made of PET, PP, etc. as the base material, and various electronic pastes are printed by screen printing, baking and other processes. Thin film circuits have many advantages such as good flexibility, light weight, stable transmission performance, impact resistance, low price, green environmental protection, etc., and are now widely used in electronic mechanical automation control, instrumentation, medical equipment, consumer electronics, computers, communications, measurement and household Button parts of electrical appliances, toys and other products. [0003] In order to ensure the reliability of the thin film circuit, it is usually necessary to use waterproof glue to seal the entire thin film circuit to protect the electronic ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J133/00C09J11/06C09J11/08
Inventor 董飞龙李兵欧阳旭频
Owner SUZHOU BETELY POLYMER MATERIALS CO LTD
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