Hot plate preventing drifting of wafer during placement

Abstract

The invention discloses a hot plate preventing drifting of a wafer during placement, and belongs to the technical field of semiconductor device tools. The hot plate comprises a hot plate body (10), wherein the hot plate body (10) is provided with through holes (11); the hot plate further comprises a plurality of drifting-preventing components (20) arranged on the hot plate body (10). Each drifting-preventing component (20) comprises a metal column (21) and a hard metal wire (22), wherein the diameter of the hard metal wire (22) is smaller than that of the metal column (21), and the hard metal wire (22) is perpendicularly fixed to the top of the metal column (21). The drifting-preventing components (20) are arranged on the circumference of the hot plate body (10), the height of the drifting-preventing components (20) can be adjusted vertically in the through holes (11) relative to the hot plate body (10), so that the tops of the hard metal wires (22) are exposed out of the front face of the hot plate body (10), and the endpoints of all the hard metal wires (22) are equal in height. The hot plate preventing drifting of the wafer during placement is good in safety performance, convenient and fast to replace, and capable of being repeatedly used for a long time.

Description

technical field [0001] The invention relates to a hot plate for baking wafers in a chip processing process, in particular to a hot plate for preventing drift when the wafer is placed, and belongs to the technical field of semiconductor equipment tooling. Background technique [0002] In the photolithography process flow of semiconductor device manufacturing, the heat treatment of wafer is an extremely important process step. During the heat treatment process of the wafer, the hot plate does not directly contact the wafer, but mainly heats the wafer through heat radiation. Generally, after the photoresist is coated on the wafer, after the exposure is completed, and after the development is completed, it is necessary to use a hot plate to perform heat treatment on the wafer. Heat treatment can have a great impact on the film thickness and final CD of the photoresist. [0003] Usually the surface of the hot plate is very flat, and the back of the wafer is also flat. If there ...

AI Technical Summary

Problems solved by technology

[0005]1. The non-slip contact 120 installed on the surface of the hot plate will fall off after a period of use, so that there is a hidden danger to the safety of the wafer. One-time installation, it cannot be repaired after falling, causing the hot plate to be scrapped;

[0006] 2. The anti-slip gasket 110 installed on the periphery of the hot plate can surround the wafer to place the drift, for example, in the direction shown by arrow A, the wafer 200 is moved by the mechanical arm Transfer to the hot plate 100, but when the robot arm transferring the wafer is improperly placed due to position deviation, so that one side of the wafer leans against the peripheral anti-slip washer 110, the phenomenon of wafer tilting occurs, such as Figure 3, the thickness of the photoresist film will vary Uniformity, resulting in non-uniform critical dimensions, which will lead to the disappearance of photolithographic patterns in severe cases; if abnormal wafers are not detected and flow to the final test, the product will be scrapped

Images