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Ultra-thin flexible circuit board blind hole machining method

A technology of flexible circuit boards and processing methods, which is applied to printed circuits, printed circuit manufacturing, electrical components, etc., can solve problems such as poor machinability, ensure machinability, improve product reliability and product yield, and reduce manufacturing costs. cost effect

Inactive Publication Date: 2014-05-14
杨秀英
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

9 or 12um raw materials, if the double-sided direct thinning process is adopted, a large number of blind holes will still be scrapped during laser processing or hole treatment before copper plating, and the machinability is poor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The present invention will be specifically introduced below in conjunction with specific embodiments.

[0017] A method for processing blind holes in an ultra-thin flexible circuit board. The raw material used is a double-sided flexible circuit board. The insulating film between the board and the B-side flexible circuit board, the processing method includes the following steps:

[0018] (1) Steps for punching the flexible circuit board on side B: a. Laminate the protective film on the flexible circuit board on side A with a laminating machine; the function of the protective film is to prevent the effective area of ​​the copper foil on side A from being affected by the next processing process corrosion or damage. b, using a solvent to thin the B-side flexible circuit board into a B-side thin flexible circuit board; c, using a laser machine to punch holes in the B-side thin flexible circuit board to make blind holes, and the blind hole processing direction is B facing A ...

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PUM

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Abstract

The invention discloses an ultra-thin flexible circuit board blind hole machining method. A raw material is a double-face flexible circuit board which comprises a face A flexible circuit board body, a face B flexible circuit board body and an insulating film attached to the position between the face A flexible circuit board body and the face B flexible circuit board body. The machining method includes the following steps of (1) punching the face B flexible circuit board body and (2) punching the face A flexible circuit board body. During single-face blind hole machining, double-face blind hole machining and machining of a product with a copper thickness of 12 micrometers or smaller than 12 micrometers, good machining performance and quality guarantee can be guaranteed during laser machining or other manufacturing procedures, and accordingly machinability of the product is guaranteed; reliability and the yield of the product can be greatly improved, and manufacturing cost is reduced.

Description

technical field [0001] A method for processing a blind hole of a circuit board, and a method for processing a blind hole of an ultra-thin flexible circuit board. Background technique [0002] In recent years, with the lightness and multi-functionality of electronic products, the wiring density of internal flexible circuits is required to be higher and higher, and products with single-sided blind holes or double-sided blind holes continue to appear. At the same time, in order to achieve the characteristics of softness, bending resistance and thinner, the final copper thickness of the product is also very thin, that is, the insulation layer of raw materials is required, and the thickness of the copper layer of the final product is relatively thin. Due to the unreliability of the output energy of the laser head and the fluctuation of the copper thickness and the thickness of the insulating layer when laser processing blind holes, when the copper foil is thin, the laser processi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 杨秀英
Owner 杨秀英
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