Cutting method of liquid crystal panel, and liquid crystal panel

A liquid crystal panel, cutting method technology, applied in glass cutting device, optics, glass manufacturing equipment and other directions

Inactive Publication Date: 2014-05-28
BEIJING BOE OPTOELECTRONCIS TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is how to r

Method used

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  • Cutting method of liquid crystal panel, and liquid crystal panel
  • Cutting method of liquid crystal panel, and liquid crystal panel
  • Cutting method of liquid crystal panel, and liquid crystal panel

Examples

Experimental program
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Effect test

Embodiment 1

[0038] Embodiment 1 of the present invention provides a cutting method of a liquid crystal panel, and the steps are as follows: figure 2 shown, including:

[0039] Step S1, shielding the frame sealant in the cutting area on the substrate;

[0040] Step S2, curing the frame sealant in the cutting area by UV curing and heat curing;

[0041] Step S3, cutting the liquid crystal panel along the cutting line on the cutting area.

[0042] In the prior art, after the frame sealant is fully cured, it is necessary to use the complex cutting process of cutter wheel cutting and laser cutting. During the cutting process, there will be poor cutting due to the sealant covering the cutting line, but this embodiment passes Covering the sealing glue in the cutting area, reducing the curing rate of the sealing glue in the cutting area, can avoid the bad splits during cutting, only need to use the knife wheel to cut, no need for laser cutting, and reduce the operation of the cutting process C...

Embodiment 2

[0052] Embodiment 2 of the present invention also provides a method for cutting a liquid crystal panel. The steps are the same as in Embodiment 1, but the difference from Embodiment 1 is that in this embodiment, the blocking of the sealant in the cutting area on the substrate specifically includes :

[0053] The shielding layer 20 is fabricated on the cutting line on the substrate, the shielding layer 20 is located outside the sealant 10 , and the cutting line is located at the center of the shielding layer 20 .

[0054] The schematic diagram of the above design is as Figure 5 As shown, the middle area is the display area X of the liquid crystal panel, the outer side of the display area X is a circle of sealant 10, and the outer circle is a circle of shielding layer 20, which plays the role of blocking ultraviolet light.

[0055] Preferably, in this embodiment, the shielding layer 20 is an opaque resin, which may be a black matrix (Black Matrix, BM for short), or other resin...

Embodiment 3

[0061] Embodiment 3 of the present invention also provides a liquid crystal panel obtained based on the cutting method provided in Embodiment 1 above, including a first substrate and a second substrate, and the sealant in the cutting area of ​​the first substrate or the second substrate is blocked .

[0062] Specifically include:

[0063] A light baffle is arranged above the cutting area for blocking ultraviolet light, the width of the light baffle is larger than that of the cutting area, and the center of the light baffle coincides with the center of the cutting area.

[0064] Wherein, the width of the light blocking plate is 0.15 mm to 0.25 mm.

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Abstract

The invention discloses a cutting method of a liquid crystal panel, and a liquid crystal panel obtained by the cutting method. Specifically, the cutting method comprises the steps of shielding seal adhesive in a cutting area on a substrate; curing the seal adhesive in the cutting area by using ultraviolet light curing and thermocuring; and cutting the liquid crystal panel along a cutting line on the cutting area. By shielding the seal adhesive in the cutting area, in a subsequent ultraviolet light curing process, ultraviolet light curing rate of the seal adhesive in the cutting area is very low because of shielding; and toughness, crosslinking degree and binding strength to the substrate of the cutting area after a thermocuring process are reduced obviously. Due to incomplete curing of the seal adhesive, poor cutting phenomena such as edge breakage and burrs in the cutting process can be prevented. Besides, the cutting method is implemented only by using cutter wheel cutting but laser cutting, thereby reducing process difficulty, shortening processing time, increasing cutting efficiency of a single liquid crystal panel and reducing production cost.

Description

technical field [0001] The invention relates to the technical field of liquid crystal display, in particular to a cutting method of a liquid crystal panel and a liquid crystal panel obtained by using the cutting method. Background technique [0002] In the manufacturing process of LCD panels, especially in the manufacturing process of small-sized narrow-frame products, the coating of frame sealant is an important step, but there are also higher and higher requirements for cutting technology in the process of manufacturing narrow-frame LCD panels. [0003] In the prior art, the liquid crystal panel is cut after the production is completed, and cut into a single liquid crystal panel to meet the use requirements. During the coating process of the frame sealant, the cutting line is often covered due to the wide coating of the frame sealant. This will lead to defects such as edge chipping and burrs during cutting. In order to avoid the above-mentioned defects during cutting, the...

Claims

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Application Information

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IPC IPC(8): C03B33/02G02F1/1333G02F1/1339
Inventor 肖昂宋省勳陈旭张飞飞
Owner BEIJING BOE OPTOELECTRONCIS TECH CO LTD
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