Electrical insulating phase-change heat conducting material and preparation method thereof

A phase-change heat-conducting and electrical insulation technology, applied in heat exchange materials, chemical instruments and methods, etc., can solve the problem that it is difficult to meet the insulation requirements of electronic components and radiators, phase-change heat-conducting materials cannot be used as electrical insulating materials, and electronic components cannot be used. Device short circuit and other problems, to achieve the effect of improving safety and reliability, good insulation, and reducing contact thermal resistance

Inactive Publication Date: 2014-06-11
NO 33 RES INST OF CHINA ELECTRONICS TECHNOOGY GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the material is not insulated, it changes into a liquid at high temperature, and after multiple extrusions, it may lead to metal-to-metal contact, which is difficult to meet the insulation requirements between some electronic components and radiators, and may easily cause short circuits in electronic components.
Therefore, traditional phase-change thermally conductive materials cannot be used as electrical insulation materials

Method used

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  • Electrical insulating phase-change heat conducting material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Weighed 42g of alumina with an average particle size of 70μm, 14g of alumina with an average particle size of 30μm, and 7g of aluminum nitride with an average particle size of 0.5μm, which were baked at 200°C to remove moisture, and mixed to obtain thermally conductive powder raw materials.

[0030] 1 g of silane coupling agent was weighed, added to the heat-conducting powder raw material, put into a high-speed mixer, and stirred at a rate of 300 rpm for 60 minutes at normal temperature and pressure to obtain a modified heat-conducting powder.

[0031] Weigh 5g of vinyl-terminated silicone oil with a viscosity of 20000cst, mix it with 10g of vinyl-terminated silicone oil with a viscosity of 3000cst, add 10g of component A in the two-component addition type liquid silicone rubber, mix well, put it in a vacuum mixer, Add the above-mentioned modified heat-conducting powder, 10.9g of paraffin-acrylic phase change microcapsules with an average particle size of 40μm, and 0.1g ...

Embodiment 2

[0035] Weighed 35g of alumina with an average particle size of 75μm, 15g of silicon carbide with an average particle size of 35μm, and 5g of silicon carbide with an average particle size of 0.7μm, which were baked at 200°C to remove moisture, and mixed to obtain thermally conductive powder raw materials.

[0036] Weigh 1.5 g of silane coupling agent, add it to the heat-conducting powder raw material, put it into a high-speed mixer, and stir at 350 rpm for 80 minutes at normal temperature and pressure to obtain a modified heat-conducting powder.

[0037] Weigh 3g of vinyl-terminated silicone oil with a viscosity of 25000cst, mix it with 7.5g of vinyl-terminated silicone oil with a viscosity of 3500cst, add 10g of component A in the two-component addition type liquid silicone rubber, mix well, and put it into a vacuum mixer , add the above-mentioned modified heat-conducting powder, 22.9g of paraffin-acrylic phase change microcapsules with an average particle size of 45μm, and 0.1...

Embodiment 3

[0041]Weighed 42g of silicon carbide with an average particle size of 80μm, 12g of alumina with an average particle size of 40μm, and 6g of aluminum nitride with an average particle size of 1μm, which were baked at 200°C to remove moisture, and mixed to obtain thermally conductive powder raw materials.

[0042] Weigh 2 g of silane coupling agent, add it to the above-mentioned heat-conducting powder raw material, put it into a high-speed mixer, and stir at 400 rpm for 100 min at normal temperature and pressure to obtain a modified heat-conducting powder.

[0043] Weigh 3g of vinyl-terminated silicone oil with a viscosity of 30000cst, mix it with 9g of vinyl-terminated silicone oil with a viscosity of 4000cst, add 10g of component A in the two-component addition type liquid silicone rubber, mix evenly, put it in a vacuum mixer, Add the above-mentioned modified heat-conducting powder, 15.9g of paraffin-acrylic phase change microcapsules with an average particle size of 50μm, and 0...

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Abstract

The invention discloses an electrical insulating phase-change heat conducting material and a preparation method thereof. The electrical insulating phase-change heat conducting material is prepared from 4-12% of two-component molding liquid silicone rubber, 10-30% of paraffin-acrylic phase change microcapsules, 50-70% of heat-conducting powder, 1-2% of silane coupling agent, and 10-25% of ethenyl terminated silicon oil. The electrical insulating phase-change heat conducting material disclosed by the invention is high in heat conductivity coefficient, low in heat resistance, and good in electrical insulating property, is in a solid state at room temperature, can be conveniently attached to the surface of a cooling fin or an electronic component; the electrical insulating phase-change heat conducting material is subjected to phase change to become soft (but not become liquid) when the working temperature of the component is achieved, the electrical insulating phase-change heat conducting material plays an electric insulating effect when the contact thermal resistance is reduced and the heat-conducting property is improved, a short circuit of the electric component is not caused, and the safety and the reliability of the electronic component are improved.

Description

technical field [0001] The invention relates to a thermal interface phase-change heat-conducting material, in particular to an electrical insulation phase-change heat-conducting material and a preparation method of the heat-conducting material. Background technique [0002] High temperature will have a harmful effect on the stability, reliability and life of electronic components. For every 2°C increase in the temperature of electronic components, the reliability will decrease by 10%. The life at 50°C is only 1 / 6 of that at 25°C. Improvements in thermal conductivity are often accompanied by optimizations in heat dissipation. It can be seen that heat dissipation is very important for the miniaturization, densification and improvement of the precision of electronic equipment. In order to solve the problem of heat dissipation of heat-generating electronic components, heat sinks are usually used to dissipate heat from the components. However, limited to the existing industrial...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/06
Inventor 王执乾王月祥张恩贵朱毅张世麟白翰林张小刚孟德文
Owner NO 33 RES INST OF CHINA ELECTRONICS TECHNOOGY GRP
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