A method for preparing polyamide-based thermally conductive composite materials by melt blending

A heat-conducting composite material and melt-blending technology, which is applied in the field of preparation of polymer-based composite materials, can solve the problems of low thermal conductivity of polymer materials, improve dispersion, improve thermal conductivity and mechanical properties, and improve thermal conductivity. Effect

Inactive Publication Date: 2016-08-24
HANGZHOU QIANSHI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem of low thermal conductivity of polymer materials by means of melt blending, and to provide a method for preparing polyamide-based thermally conductive engineering plastics with high thermal conductivity, excellent mechanical properties and processability

Method used

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  • A method for preparing polyamide-based thermally conductive composite materials by melt blending

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] First, 400g of thermally conductive filler is surface-treated in a high-speed mixer with 0.5% coupling agent NDZ-311; then the mass ratio of carrier resin / thermally conductive filler / antioxidant / anti-ultraviolet light is stabilized The multi-functional masterbatch is granulated together with the twin-screw extruder, and the temperature of the barrel of the extruder is controlled at 120°C to 140°C; finally, the multifunctional masterbatch is mixed with 100g of polyamide 6 and 10g of hot water Mix the non-tropic liquid crystal polymers evenly, and dry them in a vacuum at 80°C for 4 hours, and then extrude them with a twin-screw extruder to prepare polyamide-based thermally conductive composite materials. The temperature of the barrel is controlled at 210°C to 280°C, and the vacuum device is kept on.

[0017] The thermal conductive composite material prepared above was prepared by injection molding, and the performance test results are as follows: thermal conductivity is 6....

Embodiment 2

[0019] First, 400g of thermally conductive filler is surface-treated in a high-speed mixer with 1% coupling agent NDZ-311; then the carrier resin / thermally conductive filler / antioxidant / anti-ultraviolet light stabilized The multi-functional masterbatch is granulated together with the twin-screw extruder, and the temperature of the barrel of the extruder is controlled at 120°C to 140°C; finally, the multifunctional masterbatch is mixed with 100g of polyamide 6 and 10g of hot water Mix the non-tropic liquid crystal polymers evenly, and dry them in vacuum at 80°C for 4 hours, and then extrude them with a twin-screw extruder to prepare polyamide-based heat-conducting composite materials. The temperature of the barrel is controlled at 210-280°C, and the vacuum device is kept open.

[0020] The heat-conducting composite material prepared above was prepared by injection molding, and the performance test results are as follows: thermal conductivity is 5.7W / m·k, tensile strength is 56.3...

Embodiment 3

[0022] First, 700g of thermally conductive filler is surface-treated with 1.5% titanate coupling agent NDZ-311 in a high-speed mixer; The UV stabilizer is granulated together with a twin-screw extruder to make a multifunctional masterbatch, and the temperature of the barrel of the extruder is controlled at 120°C to 140°C; finally, the prepared multifunctional masterbatch is mixed with 100g of polyamide 6 and Mix 10g of thermotropic liquid crystal polymers evenly, and dry them together in vacuum at 80°C for 4 hours, and then extrude them with a twin-screw extruder to prepare polyamide-based thermally conductive composite materials. The temperature of the barrel is controlled at 210-280°C, and the vacuum device is kept open .

[0023] The thermal conductive composite material prepared above was prepared by injection molding, and the performance test results are as follows: the thermal conductivity is 9.5W / m·k, the tensile strength is 69.4MPa, the bending strength is 64.7MPa, and...

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Abstract

The invention relates to a method for preparing polyamide 6-based heat conduction plastic through melt blending. The method comprises the following steps: 1, preparing a multifunctional master batch from an elastomer which contains a polar group and is used as a carrier and coupling agent treated heat conduction inorganic filler particles, an antioxidant, an ultraviolet stabilizing agent and the like through a double-screw extruder; and 2, preparing the heat conduction composite material from polyamide 6, a thermotropic liquid crystal polymer and the master batch prepared in the first step through the double-screw extruder. The polyamide 6-based composite material prepared by the method disclosed by the invention is high in heat conduction performance, high in forming processing property and high in mechanical property, is suitable for injection molding, and can be widely applied to electronic appliances, mobile phone shells and LED (light emitting diode) lamp products; the heat dissipation performance of a product at high temperature is improved, and the service life of the product is prolonged.

Description

technical field [0001] The invention relates to a method for preparing a polymer-based composite material with relatively high thermal conductivity, in particular to a method for preparing a thermally conductive polymer / inorganic composite material suitable for injection molding. Background technique [0002] With the rapid development of information technology, electronic components and electronic equipment have been developed in the direction of "thin, light and small". The rapid increase of circuit density and load will cause the local temperature of electronic components to rise sharply and reduce the life span. Traditional electronic component cooling bodies and radiation cooling plates are mainly made of metal materials, pottery, and ceramic materials, which are difficult to process and heavy, which is not conducive to the development of electronic appliances in the direction of "thin, light, and small". Therefore, engineering plastics with thermal conductivity, light ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29B9/06C08L77/02C08L51/06C08L67/04C08K13/06C08K9/04C08K3/22C08K3/08C08K7/06
Inventor 董玉欣王鑫蔡伟王勇杰乔梁车声雷姜力强郑精武
Owner HANGZHOU QIANSHI TECH
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