Phenolic foam plate containing nanometer aerogel and production method of phenolic foam plate

A technology of phenolic foam board and nano airgel, applied in the preparation of phenolic foam board, the preparation of said phenolic foam board, the field of phenolic foam board containing nano airgel

Active Publication Date: 2014-06-18
SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above problems of high thermal conductivity and poor toughness of the phenolic foam board, the present invention provides a method that can provide the strength and oxygen index of the phenolic foam board, A Phenolic Foam Board Containing Nano-Aerogels with Reduced Thermal Conductivity

Method used

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  • Phenolic foam plate containing nanometer aerogel and production method of phenolic foam plate

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Experimental program
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Effect test

Embodiment 1

[0030] 100 parts by mass of phenolic resin, 8 parts by mass of isopentane, 5 parts by mass of castor oil polyoxyethylene ether, and 5 parts by mass of toughening agent (obtained by mixing polyvinylpyrrolidone and ethylene glycol at a mass ratio of 1:3.5) , 3 parts by mass of aluminum hydroxide, 3 parts by mass of nano-scale silica airgel filler and 20 parts by mass of curing agent (the curing agent is a mixed curing mixture of p-toluenesulfonic acid, phosphoric acid and sulfuric acid in a ratio of 5:3:2 agent) to stir and mix evenly, quickly pour it into a 32×32×4cm mold preheated at 65°C for foaming, and cure at 65°C for 10 minutes to obtain phenolic foam A-1, and its performance indicators are listed in Table 1.

Embodiment 2

[0032] 100 parts by mass of phenolic resin, 8 parts by mass of isopentane, 5 parts by mass of castor oil polyoxyethylene ether, and 5 parts by mass of toughening agent (obtained by mixing polyvinylpyrrolidone and ethylene glycol at a mass ratio of 1:3.5) , 3 parts by mass of aluminum hydroxide, 5 parts by mass of nano-scale silica airgel filler and 20 parts by mass of curing agent (the curing agent is a mixed curing agent mixed with p-toluenesulfonic acid, phosphoric acid and sulfuric acid in a ratio of 5:3:2 agent) to stir and mix evenly, quickly pour it into a preheated 65°C 32×32×4cm mold for foaming, and cure at 65°C for 10 minutes to obtain phenolic foam A-2, and its performance indicators are listed in Table 1.

Embodiment 3

[0034] 100 parts by mass of phenolic resin, 8 parts by mass of isopentane, 5 parts by mass of castor oil polyoxyethylene ether, and 5 parts by mass of toughening agent (obtained by mixing polyvinylpyrrolidone and ethylene glycol at a mass ratio of 1:3.5) , 3 parts by mass of aluminum hydroxide, 1 part by mass of nano-scale silica airgel filler and 20 parts by mass of curing agent (the curing agent is a mixed curing mixture of p-toluenesulfonic acid, phosphoric acid and sulfuric acid in a ratio of 5:3:2 agent) to stir and mix evenly, quickly pour it into a 32×32×4cm mold preheated at 65°C to foam, and cure at 65°C for 10 minutes to obtain phenolic foam A-3, and its performance indicators are listed in Table 1.

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Abstract

The invention relates to the technical field of phenolic foam plates and in particular relates to a phenolic foam plate containing nanometer aerogel. The phenolic foam plate containing nanometer aerogel comprises the following raw materials: phenolic resin, an emulsifying agent, a toughening agent, a foaming agent, nanometer aerogel, a fire retardant and a curing agent according to a weight ratio of 100: (1-10): (1-10): (7-12): (2-15): (2-15): (15-25). The toughening agent is prepared by mixing polyvinyl pyrrolidone with ethylene glycol according to a weight ratio being 1: (1-5). A production method of the phenolic foam plate containing nanometer aerogel comprises the following steps: evenly mixing and stirring the raw materials and pouring the raw materials into a preheated die to foam and cure. By taking the nanometer aerogel as filler and adding the special toughening agent, the strength of the plate can be improved; a compression strength is increased from about 0.14 to be greater than 0.18; a pulling strength is increased from about 0.07 to be greater than 0.12; a heat conductivity coefficient of the plate is reduced to be less than 0.022; an oxygen index is increased from about 45 to be 55.

Description

technical field [0001] The invention relates to the technical field of phenolic foam boards, in particular to a phenolic foam board containing nano airgel, and also to a preparation method of the phenolic foam board. Background technique [0002] Phenolic foam is a commonly used thermal insulation material because of its readily available raw materials, low price, and easy production. However, the problem is that the heat insulation effect is not ideal. The thermal conductivity of the phenolic foam board is relatively high. The thermal conductivity of the phenolic foam board on the market is basically around 0.032W / (m??K). There is a lot of competitive pressure in terms of thermal insulation performance of thermal insulation materials. Moreover, the toughness is not good, and the drawing and compressive strength are also dominant. Therefore, reducing the thermal conductivity of phenolic foam board and increasing its toughness is a main direction of phenolic foam research...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J9/14C08L61/06C08L39/06C08K3/36C08K3/22C08K5/053
Inventor 邓刚彭绵广宋长啸秦海洋乔林
Owner SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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