Application of organic phosphate surfactant in self-stopping polishing
A technology of surfactant and phosphate ester, which is applied in polishing compositions containing abrasives, other chemical processes, chemical instruments and methods, etc., can solve problems such as high removal rates, achieve high copper removal rates, and improve butterfly depressions and overpolishing window, shortening the polishing time effect
Inactive Publication Date: 2014-06-18
ANJI MICROELECTRONICS (SHANGHAI) CO LTD
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Problems solved by technology
The above-mentioned phosphate ester surfactant can maintain a high copper removal rate, improve the dish-shaped depression and over-polishing window of the copper wire after polishing, and the copper surface after polishing has less pollutants and no defects such as corrosion
Method used
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Embodiment 1~49
[0040] Table 1 shows Examples 1-49 of the chemical mechanical polishing solution of the present invention. According to the formula given in the table, the other components except the oxidizing agent are mixed evenly, and the mass percentage is made up to 100% with water. with KOH or HNO 3 Adjust to desired pH. Add oxidant before use and mix evenly.
[0041] Table 1 Example 1~49
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[0045]
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Abstract
The invention provides an application of an organic phosphate surfactant in self-stopping polishing. The organic phosphate surfactant has the advantages of maintenance of a high copper removal rate, improvement of the saucerization and the over polishing window of polished copper wires, few pollutants on the surface of polished copper, no corrosion and the like.
Description
technical field [0001] The invention relates to the application of a phosphate ester surfactant in self-stop polishing. Background technique [0002] With the development of semiconductor technology and the miniaturization of electronic components, an integrated circuit contains millions of transistors. In the process of operation, after integrating such a large number of transistors that can switch quickly, the traditional aluminum or aluminum alloy interconnection wires reduce the speed of signal transmission, and consume a lot of energy in the process of current transmission. In a certain sense, It also hinders the development of semiconductor technology. For further development, people began to look for materials with higher electrical properties to replace the use of aluminum. As we all know, copper has low resistance and good conductivity, which speeds up the transmission speed of signals between transistors in the circuit, and also provides smaller parasitic capacit...
Claims
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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02C23F3/04C23F3/06
CPCC09G1/02C09K3/1454
Inventor 荆建芬张建蔡鑫元
Owner ANJI MICROELECTRONICS (SHANGHAI) CO LTD
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