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Adhesive-adjusting special composite powder

A compound powder and glue mixing technology, which is applied in the direction of adhesive additives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problems of moldy boards and expensive prices, and achieve large production capacity and convenient operation , The effect of simple production process

Inactive Publication Date: 2014-06-18
TIANJIN XINNENG WALL INSULATION MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a special composite powder for glue adjustment, which solves the problems that the existing plywood filling powder is expensive and easy to make the board moldy

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Weigh 2kg of acrylamide, 1kg of starch ether, 1kg of xanthan gum, 8kg of adhesive powder, 10kg of wood flour (80 mesh), and 78kg of alkalized sodium saline soil.

[0027] Put all the raw materials into the mixer, stir quickly, mix, pack, and get the finished product.

Embodiment 2

[0029] Weigh 3kg of acrylamide, 1.5kg of starch ether, 1.5kg of xanthan gum, 12kg of adhesive powder, 15kg of wood flour (200 mesh), and 67kg of alkalized sodium saline soil.

[0030] Put all the raw materials into the mixer, stir quickly, mix, pack, and get the finished product.

Embodiment 3

[0032] Weigh 2.5kg of acrylamide, 1.25kg of starch ether, 1.25kg of xanthan gum, 10kg of adhesive powder, 12.5kg of wood flour (140 mesh), and 72.5kg of alkalized sodium saline soil.

[0033] Put all the raw materials into the mixer, stir quickly, mix, pack, and get the finished product.

[0034] The use method and requirements of the special compound powder for glue adjustment:

[0035] 1: The special compound powder for glue adjustment has good initial viscosity, and it can be used alone instead of industrial flour in direct hot pressing production of plywood. The special compound powder for glue adjustment can be used to replace more than 60% of industrial flour when producing building templates by cold pressing.

[0036] 2: The usage amount of the special compound powder for glue adjustment should be determined according to the concentration (solid content) of the resin glue. If the glue concentration is high, use less, and if the glue concentration is small, you can add ...

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Abstract

A disclosed adhesive-adjusting special composite powder is composed of the following raw materials by weight: 2-3% of acrylamide, 1-1.5% of starch ether, 1-1.5% of xanthan gum, 8-12% of bonding adhesives powder, 10-15% of wood powder and 67-78% of alkalized sodium solonchak. The adhesive-adjusting special composite powder helps to save the usage amount of industrial flour, is a non-toxic odorless fireproof deterioration-free mildew-free green environment-friendly functional material, is formed by processing and combining an organic material and an inorganic material through a special production technology, is a novel material with a unique molecular structure and chemical characteristics, and has the characteristics of large specific surface area, more gaps, good fluidity, dispersibility, moisture retention and absorptivity, good viscosity, and low hardness. After mixed with a resin glue, the adhesive-adjusting special composite powder is good in caking property, suspension property, dispersibility, fluidity, absorptivity and thixotropy. The adhesive-adjusting special composite powder is mainly applied to building templates of melamine glue.

Description

technical field [0001] The invention relates to a composite powder specially used for glue adjustment, which is mainly used in building formwork of triamine glue. Background technique [0002] At present, the fillers used in the production of plywood generally use industrial flour, which is expensive and used in large quantities. The special compound powder for glue adjustment is used instead of part of the flour, which can save food and cost, and achieve the same effect as flour. Contents of the invention [0003] (1) Technical problems to be solved [0004] The technical problem to be solved by the present invention is to provide a special compound powder for glue adjustment, which solves the problems that the existing plywood filler powder is expensive and easy to make the board moldy. [0005] (2) Technical solution [0006] In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is: [0007] A spe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J11/04C09J11/08C09J11/06
Inventor 张顺利
Owner TIANJIN XINNENG WALL INSULATION MATERIAL CO LTD
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