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Non-cyanide bright electroplated silver composite additive and application method thereof in non-cyanide silver electroplating system

A technology of bright electroplating and inorganic additives, which is applied in the field of electroplating silver, can solve the problems of easy failure when exposed to light, narrow current density range, and narrow temperature window, so as to expand the working current density range, realize green environmental protection, and increase the electrodeposition speed Effect

Inactive Publication Date: 2014-09-03
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The research work on cyanide-free silver plating is mainly to find a suitable complexing agent to replace the coordination of cyanide ions in silver plating. Up to now, the organic There are about dozens of inorganic or inorganic silver ion complexing agents, but the currently used cyanide-free silver plating system generally has poor stability of the plating solution, easy failure when exposed to light, poor resistance to cold and heat exchange, and low coating performance. The process conditions are harsh, the temperature window is narrow, the current density range is narrow, etc.

Method used

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  • Non-cyanide bright electroplated silver composite additive and application method thereof in non-cyanide silver electroplating system
  • Non-cyanide bright electroplated silver composite additive and application method thereof in non-cyanide silver electroplating system
  • Non-cyanide bright electroplated silver composite additive and application method thereof in non-cyanide silver electroplating system

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specific Embodiment approach 2

[0038] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the composition of the electroplating silver combination additive is as follows: polyethylene glycol 0.25g / L, 2,2-bipyridine 10g / L, polyethyleneimine 0.1g / L, tartaric acid 0.5g / L, barium nitrate 0.1g / L, lanthanum nitrate 0.05g / L, sodium selenite 1.25g / L to prepare cyanide-free electroplating silver plating combination additives, in the pre-plating silver process, in the plating The dosage of the additive in the liquid is 1~45ml / L. figure 1 It is the SEM picture of the electroplated silver coating without additives, figure 2 It is the SEM picture of the silver plating layer after adding the silver plating additive. Depend on figure 2 It can be seen that after electroplating with the additive provided in this embodiment, a silver plating layer with a macroscopic mirror gloss, uniform and flat appearance, uniform and dense microscopic crystals observed by SEM, no cracks, and...

specific Embodiment approach 3

[0039] Specific embodiment three: the difference between this embodiment and specific embodiment two is that the silver electroplating composite additive is composed of: 5 g / L of succinimide, 1.5 g / L of 2-aminopyridine, and 3 g / L of uracil , sodium dodecylbenzene sulfonate 1g / L, potassium selenocyanate 1.0g / L, and copper manganate 0.1g / L are formulated as silver plating additives. L. After electroplating, a silver-plated layer with specular luster macroscopically, uniform and smooth appearance, uniform and dense microscopic crystals observed by SEM, no cracks, and excellent coating leveling ability observed by AFM is obtained.

specific Embodiment approach 4

[0040] Embodiment 4: The difference between this embodiment and Embodiment 2 is that the combined additive for electroplating silver is composed of: hypoxanthine 4.5g / L, piperonal 1.5g / L, thiourea 1.5g / L, hydroxyl Ethylethylenediaminetriacetic acid 3g / L, cadmium nitrate 0.5g / L, and sodium thiosulfate 0.25g / L were used to prepare the combined silver plating additives. The dosage of the additives in the high-speed silver plating process was 5~35ml / L. After electroplating, a silver-plated layer with specular luster macroscopically, uniform and smooth appearance, uniform and dense microscopic crystals observed by SEM, no cracks, and excellent coating leveling ability observed by AFM is obtained.

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Abstract

The invention relates to a non-cyanide bright electroplated silver composite additive and an application method thereof in a non-cyanide silver electroplating system, and belongs to the technical field of silver electroplating. The electroplated silver composite additive is characterized in that the combination of an inorganic additive and an organic additive is adopted, so that the adding quantity of the additive is wide in range; the solution electroplating performance and the coating electroplating performance of the non-cyanide silver electroplating system are obviously improved due to the addition of the corresponding combined additive. The non-cyanide bright electroplated silver composite additive cannot be decomposed in storage and application processes because of having extremely high stability, and can be used for effectively accelerating the electrolytic deposition speed of a silver electroplating layer without influencing the current efficiency of a cathode at the same time. Thus, the density range of a permissible working current is effectively enlarged; the silver electroplating layer with excellent performance can be obtained; the non-cyanide silver electroplating system in which the additive is added is suitable for production requirements in different fields; the silver electroplating carried out by virtue of cyanides can be completely replaced with the non-cyanide silver electroplating system in the industrial production and the application field. As a result, the environmental friendliness of a silver electroplating process is realized.

Description

technical field [0001] The invention belongs to the technical field of electroplating silver, and relates to a composite additive for electroplating silver and its application method in a cyanide-free electroplating silver system. Background technique [0002] The silver plating layer is a low price, high electrical conductivity, thermal conductivity, strong light reflectivity, good weldability, high temperature resistance, wear resistance, and resistance to most acids and alkalis. The chemically stable metal coating, so the silver coating is widely used in various industries, including jewelry, commemorative coins, electronics, instruments, meters, aviation, aerospace and other industrial fields, as well as connector electroplating and so on. [0003] Since the British Elkington brothers first applied for the patent of cyanide electroplating silver more than 100 years ago, the cyanide electroplating silver system has the advantages of simple plating solution composition, lo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/46
Inventor 安茂忠刘安敏任雪峰杨培霞张锦秋张杰
Owner HARBIN INST OF TECH
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