Flexible metal clad laminate and preparation method thereof

A flexible metal and manufacturing method technology, applied in the direction of metal layered products, chemical instruments and methods, and manufacturing printed circuit precursors, can solve the problem of low adhesion, achieve excellent adhesion and dimensional stability, and inhibit The effect of poor appearance problems

Active Publication Date: 2014-09-24
NEXFLEX CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem that the flexible metal foil laminate with the above-mentioned structure has low adhesion to anisotropic conductive film (ACF, Anisotropic Conductive Film) used in liquid crystal display devices, touch panels, etc.

Method used

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  • Flexible metal clad laminate and preparation method thereof
  • Flexible metal clad laminate and preparation method thereof
  • Flexible metal clad laminate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0122] With the contents in Table 1, 1638 g of PDA and 758 g of diamine of ODA were stirred and completely dissolved in 32416 g of DMAc solution under a nitrogen atmosphere, and then 5700 g of BPDA was added in fractions as dianhydride. Thereafter, stirring was continued for about 24 hours, thereby preparing a polyamic acid solution. After casting (casting) the polyamic acid solution prepared in this way into a film with a thickness of 20 μm, the temperature was raised to 350° C. over 60 minutes and maintained for 30 minutes to cure. The measured linear thermal expansion coefficient and glass transition temperature were 13.3 ppm / K and 321° C., respectively.

Synthetic example 2

[0123] Synthesis Example 2 to Synthesis Example 3

[0124] It was prepared by the same method as Synthesis Example 1 using the composition and content in Table 1, and Table 1 shows the measured linear thermal expansion coefficient and glass transition temperature.

[0125] Table 1. Composition of polyamic acid solution and linear thermal expansion coefficient and glass transition temperature after complete imidization

[0126]

Embodiment 1

[0128] After coating the polyamic acid solution prepared in Synthesis Example 2 on an electrolytic copper foil (roughness Rz = 2.0 μm) with a thickness of 12 μm so that the final cured thickness becomes 4 μm, it was dried at 130° C. A first polyimide precursor layer was formed. The polyamic acid solution prepared in Synthesis Example 1 was coated on one side of the first polyimide precursor layer so that the final cured thickness was 13 μm, and then dried at 150° C. to form the second polyimide precursor layer. Polyimide precursor layer. After that, the thermoplastic polyamic acid solution prepared in Synthesis Example 3 was coated on one side of the second polyimide precursor layer so that the thickness after final curing was 3.5 μm, and then dried at 150° C. to form A third polyimide precursor layer was formed. The multi-layer polyimide precursor layer on the copper foil produced in this way was completely imidized according to the curing condition 1 in Table 2 by using an...

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Abstract

The present invention provides a flexible metal clad laminate comprising a multilayered polyimide film comprising: a metal foil; a first polyimide layer having a glass transition temperature of 300 DEG C or lower, located on the metal foil; a second polyimide layer located on the first polyimide layer; and a third polyimide layer located on the second polyimide layer. According to the present invention, the flexible metal clad laminate solves the problem of appearance defects due to foaming and the like during a curing process in a continuous curing device using infrared rays as a heat source, shows no delamination due to excellent adhesive strength, and has remarkable ACF adhesive strength and dimensional stability, and is thus expected to be useful for preparation of a flexible printed circuit board.

Description

technical field [0001] The present invention relates to a flexible metal foil laminate used in the manufacture of a flexible printed circuit board, and more specifically relates to manufacturing by heating polyamic acid, which is a precursor of polyimide, under high temperature conditions and finally converting it into polyimide A flexible metal foil laminate and a method of manufacturing the same. Background technique [0002] Flexible Metal Clad Laminate, used in the manufacture of Flexible Printed Circuit Boards, is a laminate of conductive metal foil (Metal Foil) and insulating resin, enabling fine circuit processing , and can be bent in a narrow space. Accordingly, the use of flexible metal foil laminates in notebook computers, portable information terminals, small video cameras, storage disks, and the like has been increasing in line with the trend toward miniaturization and weight reduction of electronic equipment. [0003] The flexible metal foil laminate related t...

Claims

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Application Information

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IPC IPC(8): B32B15/08B32B37/02
CPCH05K2201/05H05K1/056Y10T428/24942H05K1/0346H05K1/0393H05K2201/068Y10T156/10H05K1/036H05K3/022H05K2201/0154B32B15/08C08G73/10H05K1/03
Inventor 金燮澔李庸石崔元重金大年金永道
Owner NEXFLEX CO LTD
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