A kind of preparation method of ultrafine nickel-coated copper powder for electronic industry

Abstract

The invention discloses a preparation method of superfine nickel coated copper powder for electronic industry. The preparation method comprises the following steps: (1) performing de-oiling and surface cleaning on an aluminum material; (2) immersing the processed aluminum material in the step (1) into a copper chloride solution, and performing displacement reaction on the aluminum material to obtain a sponge-shaped copper body so as to obtain the aluminum material with copper; (3) soaking and cleaning the aluminum material with the copper in clear water, and electroplating the aluminum material with the copper in nickel electroplating liquid, wherein an electroplating process comprises the following steps: taking the aluminum material with the copper as a cathode and a nickel block as an anode, and electroplating under the electroplating voltage ranging from -1.2V to -2.8V for 1 minute to 15 minutes; (4) soaking and cleaning the aluminum material with the copper processed in the step (3), ultrasonically dispersing and drying to obtain the superfine nickel coated copper powder. The method is simple in process and low in cost, expensive equipment is not involved, and the raw materials and the process do not cause environmental pollution.

Description

technical field [0001] The invention relates to a preparation method of nickel-coated copper powder, in particular to a preparation method of ultrafine nickel-coated copper powder used in the electronic industry. Background technique [0002] With the development of the modern electronics industry, a large number of electronic devices enter the home, and electronic products emit electromagnetic waves, resulting in increasingly serious electromagnetic environmental pollution; on the other hand, as electronic components and circuits gradually become miniaturized and integrated, electronic products The sensitivity of environmental electromagnetic waves increases, and it is easy to be interfered by electromagnetic waves and make mistakes. How to protect and shield electromagnetic waves has become an urgent problem in modern society. Among them, the use of electromagnetic shielding conductive coatings is one of the methods to solve the problem of electromagnetic wave interference...

AI Technical Summary

Problems solved by technology

[0003] Among the existing methods, the electroless plating method is one of the most commonly used preparation methods at present, but since copper has no self-catalysis in the electroless nickel plating process, activation is often performed on the copper surface, which brings complex processes, poor controllability, Problems such as high cost and environmental pollution, such as the palladium catalyst cost used in the patent of invention (publication number CN1988973A) are too high, and the hydrazine reducing agent is highly toxic; the reducing agent hydrazine (hydrazine) used in the patent of invention (publication number CN1817521A) Hydrazine) is a highly toxic substance; the xylene used in the invention patent (authorized notification number CN101733401.B) is carcinogenic, etc.

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