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A kind of organosilicon material for LED encapsulation and preparation method thereof

A technology of LED encapsulation and organic silicon, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of increasing the production cost of LED lamps, affecting the rapid development of LED device scale production, etc., achieving good mechanical properties and improving compatibility Effect

Active Publication Date: 2017-10-20
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the packaging materials of high-power LEDs mainly rely on imports, which directly increases the production cost of LED lamps and affects the scale production and rapid development of LED devices.

Method used

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  • A kind of organosilicon material for LED encapsulation and preparation method thereof
  • A kind of organosilicon material for LED encapsulation and preparation method thereof
  • A kind of organosilicon material for LED encapsulation and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Step 1) Weigh 40g orthoethylsilicate (TEOS), 7.51g hexamethyldisiloxane (MM), 2.98g tetramethyldivinyldisiloxane (M Vi m Vi , is the end-capping agent), 10.5g water, 7.5g ethanol (ETOH), 2.4g hydrochloric acid (concentration 38%) all join in the round-bottomed flask at one time, under 200rpm stirring speed, be heated up to 80 ℃ while stirring, Reaction 3h.

[0032] Step 2) Cool to room temperature, and extract the above reaction solution with 10 g of MM. After standing still, the lower organic layer was separated and washed with 50% ethanol aqueous solution to neutrality to obtain an MQ resin solution with a solid content of 68.7%.

[0033] Step 3) Add 66 g of vinyl-terminated silicone oil with a viscosity of 5000 mPa·s into the four-necked flask, and raise the temperature to 75° C. at a stirring speed of 100 rpm. Slowly drop the above MQ resin solution into the vinyl silicone oil. After the dropwise addition was completed, stirring was continued for 1 h. After vac...

Embodiment 2

[0036] Step 1) Weigh 120g TEOS, 33.15g MM, 10.2g M respectively Vi m Vi , 7.2g HCl, 22.5g ETOH, 31.5g H 2 O was added into the round bottom flask all at once, and at a stirring speed of 100 rpm, the temperature was raised to 80° C. while stirring, and reacted for 3 h.

[0037] Step 2) Cool to room temperature and extract MQ resin with 30gMM. The lower organic layer was separated and washed with 50% aqueous ethanol until neutral to obtain a MQ resin solution with a solid content of 68%.

[0038] Step 3) Add 202.5 g of vinyl-terminated silicone oil with a viscosity of 5000 mPa·s into the four-necked flask, and raise the temperature to 75° C. while stirring at a stirring speed of 200 rpm. Slowly drop the above MQ resin solution into the vinyl silicone oil. After the dropwise addition was completed, stirring was continued for 1 h. Vacuum distillation (-0.095MPa, 50°C) extracts the toluene to obtain a liquid base rubber with an MQ content of 30%.

[0039] Mix 11g of the above...

Embodiment 3

[0041] Step 1) Weigh 120g TEOS, 32.34g MM, 11.14g M respectively Vi m Vi , 7.2g HCl, 22.5gETOH, 31.5g H 2 O was added into the round bottom flask all at once, and at a stirring speed of 150 rpm, the temperature was raised to 80° C. while stirring, and reacted for 3 h.

[0042] Step 2) Cool to room temperature and extract MQ resin with 30gMM. The lower organic layer was separated and washed with 50% aqueous ethanol until neutral to obtain an MQ resin solution with a solid content of 68.7%.

[0043] Step 3) Add 201 g of vinyl-terminated silicone oil with a viscosity of 5000 mPa·s into the four-necked flask, and raise the temperature to 75° C. while stirring at a stirring speed of 150 rpm. Slowly drop the above MQ resin solution into the vinyl silicone oil. After the dropwise addition was completed, stirring was continued for 1 h. Vacuum distillation (-0.095MPa, 50°C) extracts the toluene to obtain a liquid base rubber with an MQ content of 30%.

[0044] Mix 10g of the abov...

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Abstract

The invention discloses an organic silicon material for LED encapsulation and a preparation method thereof, comprising the following steps: (1) mixing ethyl orthosilicate, hexamethyldisiloxane, tetramethyldivinyldisiloxane, Add hydrochloric acid, ethanol and water to the reactor, stir and heat up to 70-80 ° C, react for 2-3 h, cool to room temperature, perform extraction, stand to separate the lower organic layer, wash until neutral, to obtain MQ resin solution; ( 2) Slowly add the MQ resin solution into the vinyl silicone oil dropwise at 70-80°C under stirring conditions, and continue to stir for 1-1.5 hours after the dropwise addition; the solvent is distilled off under reduced pressure to obtain a liquid base rubber; (3) the The hydrogen-containing silicone oil is mixed with the liquid base glue, then a platinum catalyst is added, and after mixing, vacuum degassing is performed, and vulcanization is carried out at 90° C. and 150° C. respectively to obtain an organic silicon material for LED packaging. The material has good optical properties and excellent mechanical properties.

Description

technical field [0001] The invention relates to an MQ resin reinforcing material for LED packaging prepared by using ethyl orthosilicate. Background technique [0002] At present, the energy consumed by human beings in the lighting field is very huge, and the development of new lighting appliances with more energy-saving effects is of great significance to the world. LED technology is currently one of the most promising high-tech fields, among which white LEDs have been widely used in lighting, car lights, LCD computer backlight sources, mobile phones and TVs, etc. LED lights have a series of advantages such as low energy consumption, long life, and no pollution. They are very beneficial to meet human needs in energy conservation and environmental protection and to alleviate energy and environmental crises. Encapsulation materials are very important for LED lights, because the quality of encapsulation materials will affect the reliability and service life of packaging, asse...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05C08G77/20H01L33/56
Inventor 潘朝群陈国栋康英姿
Owner SOUTH CHINA UNIV OF TECH