Copper wire surface tinning method

A technology of copper wire and tin plating, which is applied in the field of tin plating on the surface of copper wire, can solve the problems of increasing cost, reducing electrical conductivity, tin waste, etc., and achieves the effects of saving cost, good thermal conductivity, and reducing tin waste

Inactive Publication Date: 2014-10-08
NINGGUO XINBONENG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this technical scheme, tin atoms will diffuse to copper atoms during the tin plating process, which reduces its conductiv

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A method for tinning the surface of copper wires, comprising copper wires, tinning the surface of copper wires, comprising the following steps:

[0022] (1) Alkaline oil removal, the alkaline solution is: sodium hydroxide: 20g / L, sodium carbonate: 22g / L, sodium nitrate: 20g / L, sodium silicate: 8g / L, temperature: 60°C, duration: 14 minutes;

[0023] (2) Cleaning with running water;

[0024] (3) Drying, temperature: 85°C;

[0025] (4) Tin plating treatment, the solution is: sulfuric acid: 70g / L, stannous sulfate: 40g / L, β-naphthol: 1.0g / L, phenolsulfonic acid: 20g / L, formaldehyde: 6g / L, brightener : 8g / L, current density: 1.4A / dm 2 , temperature: 18°C, add lead acetate: 0.2g, nickel sulfate: 0.8g, sodium hypophosphite: 0.05g to each volume of the solution, and stir by moving the cathode;

[0026] (5) Wash with deionized water.

[0027] The present invention can effectively resist corrosion and wear by plating tin on the copper wire surface, and has good electrical co...

Embodiment 2

[0029] A method for tinning the surface of copper wires, comprising copper wires, tinning the surface of copper wires, comprising the following steps:

[0030] (1) Alkaline oil removal, the alkaline solution is: sodium hydroxide: 24g / L, sodium carbonate: 18g / L, sodium nitrate: 24g / L, sodium silicate: 4g / L, temperature: 65°C, duration: 12 minutes;

[0031] (2) Cleaning with running water;

[0032] (3) Drying, temperature: 90°C;

[0033] (4) Tin plating treatment, the solution is: sulfuric acid: 65g / L, stannous sulfate: 44g / L, β-naphthol: 1.0g / L, phenolsulfonic acid: 20g / L, formaldehyde: 6g / L, brightener : 8g / L, current density: 1.8A / dm 2 , temperature: 12°C, add lead acetate: 0.4g, nickel sulfate: 0.6g, sodium hypophosphite: 0.1g to each volume of the solution, and stir by moving the cathode;

[0034] (5) Wash with deionized water.

Embodiment 3

[0036] A method for tinning the surface of copper wires, comprising copper wires, tinning the surface of copper wires, comprising the following steps:

[0037] (1) Alkaline oil removal, the alkaline solution is: sodium hydroxide: 20g / L, sodium carbonate: 18g / L, sodium nitrate: 24g / L, sodium silicate: 8g / L, temperature: 60°C, duration: 14 minutes;

[0038] (2) Cleaning with running water;

[0039] (3) Drying, temperature: 85°C;

[0040] (4) Tin plating treatment, the solution is: sulfuric acid: 65g / L, stannous sulfate: 40g / L, β-naphthol: 1.0g / L, phenolsulfonic acid: 20g / L, formaldehyde: 4g / L, brightener : 8g / L, current density: 1.8A / dm 2 , temperature: 12°C, add lead acetate: 0.4g, nickel sulfate: 0.8g, sodium hypophosphite: 0.05g to each volume of the solution, and stir by moving the cathode;

[0041] (5) Wash with deionized water.

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PUM

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Abstract

The invention discloses a copper wire surface tinning method. The method comprises the following steps: 1, alkaline oil removal; 2, running water cleaning; 3, drying at 85-90DEG C; 4, tinning by using a solution containing 65-70g/L of sulfuric acid, 40-44g/L of stannous sulfate, 0.6-1.0g/L of beta-naphthol, 20-30g/L of phenolsulfonic acid, 4-6g/L of formaldehyde and 8-12g/L of a brightener under a current density of 1.4-1.8A/dm<2> at 12-18DEG C; and 5, deionized water cleaning. Copper wires with the surface tinned through the method have the advantages of effective corrosion and wear resistance, and good electricity and heat conduction; and the increase of Pb, Ni and P elements can effectively prevent the diffusion of copper atoms to the above tin solution, so the tinning quality is guaranteed, the tin cost is reduced, and the cost is saved.

Description

technical field [0001] The invention relates to the technical field of copper wire processing, in particular to a method for tinning the surface of copper wires. Background technique [0002] Silver-plated copper wire is made by concentrically plating silver on the copper core. It combines the characteristics of the two metals, has good electrical conductivity, and a bright and shiny surface, and the silver layer has high resistance to corrosion. Corrosive, it is also widely used in high-end electronic components and used as lead-out wires. [0003] Although the silver layer has strong anti-corrosion properties, if it is exposed to the air for a long time, the surface of the silver-plated copper wire is easy to react with sulfides and halides in the air, causing the surface to change color, which not only changes the appearance, but also makes the Contact resistance increases and solderability deteriorates. It has been found through experiments that the essence of the disc...

Claims

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Application Information

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IPC IPC(8): C25D3/30C25D7/06
Inventor 罗宏强
Owner NINGGUO XINBONENG ELECTRONICS
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