Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Copper wire surface tinning method

A technology of copper wire and tin plating, which is applied in the field of tin plating on the surface of copper wire, can solve the problems of increasing cost, reducing electrical conductivity, tin waste, etc., and achieves the effects of saving cost, good thermal conductivity, and reducing tin waste

Inactive Publication Date: 2014-10-08
NINGGUO XINBONENG ELECTRONICS
View PDF8 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this technical scheme, tin atoms will diffuse to copper atoms during the tin plating process, which reduces its conductivity and corrosion resistance, and also causes waste of tin and increases the cost. This technical scheme needs to be improved

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A method for tinning the surface of copper wires, comprising copper wires, tinning the surface of copper wires, comprising the following steps:

[0022] (1) Alkaline oil removal, the alkaline solution is: sodium hydroxide: 20g / L, sodium carbonate: 22g / L, sodium nitrate: 20g / L, sodium silicate: 8g / L, temperature: 60°C, duration: 14 minutes;

[0023] (2) Cleaning with running water;

[0024] (3) Drying, temperature: 85°C;

[0025] (4) Tin plating treatment, the solution is: sulfuric acid: 70g / L, stannous sulfate: 40g / L, β-naphthol: 1.0g / L, phenolsulfonic acid: 20g / L, formaldehyde: 6g / L, brightener : 8g / L, current density: 1.4A / dm 2 , temperature: 18°C, add lead acetate: 0.2g, nickel sulfate: 0.8g, sodium hypophosphite: 0.05g to each volume of the solution, and stir by moving the cathode;

[0026] (5) Wash with deionized water.

[0027] The present invention can effectively resist corrosion and wear by plating tin on the copper wire surface, and has good electrical co...

Embodiment 2

[0029] A method for tinning the surface of copper wires, comprising copper wires, tinning the surface of copper wires, comprising the following steps:

[0030] (1) Alkaline oil removal, the alkaline solution is: sodium hydroxide: 24g / L, sodium carbonate: 18g / L, sodium nitrate: 24g / L, sodium silicate: 4g / L, temperature: 65°C, duration: 12 minutes;

[0031] (2) Cleaning with running water;

[0032] (3) Drying, temperature: 90°C;

[0033] (4) Tin plating treatment, the solution is: sulfuric acid: 65g / L, stannous sulfate: 44g / L, β-naphthol: 1.0g / L, phenolsulfonic acid: 20g / L, formaldehyde: 6g / L, brightener : 8g / L, current density: 1.8A / dm 2 , temperature: 12°C, add lead acetate: 0.4g, nickel sulfate: 0.6g, sodium hypophosphite: 0.1g to each volume of the solution, and stir by moving the cathode;

[0034] (5) Wash with deionized water.

Embodiment 3

[0036] A method for tinning the surface of copper wires, comprising copper wires, tinning the surface of copper wires, comprising the following steps:

[0037] (1) Alkaline oil removal, the alkaline solution is: sodium hydroxide: 20g / L, sodium carbonate: 18g / L, sodium nitrate: 24g / L, sodium silicate: 8g / L, temperature: 60°C, duration: 14 minutes;

[0038] (2) Cleaning with running water;

[0039] (3) Drying, temperature: 85°C;

[0040] (4) Tin plating treatment, the solution is: sulfuric acid: 65g / L, stannous sulfate: 40g / L, β-naphthol: 1.0g / L, phenolsulfonic acid: 20g / L, formaldehyde: 4g / L, brightener : 8g / L, current density: 1.8A / dm 2 , temperature: 12°C, add lead acetate: 0.4g, nickel sulfate: 0.8g, sodium hypophosphite: 0.05g to each volume of the solution, and stir by moving the cathode;

[0041] (5) Wash with deionized water.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a copper wire surface tinning method. The method comprises the following steps: 1, alkaline oil removal; 2, running water cleaning; 3, drying at 85-90DEG C; 4, tinning by using a solution containing 65-70g / L of sulfuric acid, 40-44g / L of stannous sulfate, 0.6-1.0g / L of beta-naphthol, 20-30g / L of phenolsulfonic acid, 4-6g / L of formaldehyde and 8-12g / L of a brightener under a current density of 1.4-1.8A / dm<2> at 12-18DEG C; and 5, deionized water cleaning. Copper wires with the surface tinned through the method have the advantages of effective corrosion and wear resistance, and good electricity and heat conduction; and the increase of Pb, Ni and P elements can effectively prevent the diffusion of copper atoms to the above tin solution, so the tinning quality is guaranteed, the tin cost is reduced, and the cost is saved.

Description

technical field [0001] The invention relates to the technical field of copper wire processing, in particular to a method for tinning the surface of copper wires. Background technique [0002] Silver-plated copper wire is made by concentrically plating silver on the copper core. It combines the characteristics of the two metals, has good electrical conductivity, and a bright and shiny surface, and the silver layer has high resistance to corrosion. Corrosive, it is also widely used in high-end electronic components and used as lead-out wires. [0003] Although the silver layer has strong anti-corrosion properties, if it is exposed to the air for a long time, the surface of the silver-plated copper wire is easy to react with sulfides and halides in the air, causing the surface to change color, which not only changes the appearance, but also makes the Contact resistance increases and solderability deteriorates. It has been found through experiments that the essence of the disc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C25D3/30C25D7/06
Inventor 罗宏强
Owner NINGGUO XINBONENG ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com