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Sheet-shaped covering agent, covering method or manufacturing method of electronic device

A sheet-like and component-based technology, applied in the field of sheet-like covering agents, can solve problems such as the need for a crimping process, adverse effects on devices, and complicated formation of a primary film, and achieve the effects of preventing defective products, high productivity, and high stress relaxation

Inactive Publication Date: 2017-09-01
DAICEL CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method uses a laminated sheet having a photocurable resin layer, and requires a pressure bonding process, a photocuring process, and a peeling process of the transparent resin film, and the formation of the primary film is complicated.
In addition, since the photocurable resin shrinks along with photocuring, shrinkage stress acts on the device, and the shrinkage stress remains in the disposable film, which may adversely affect the device. The decomposed product remains in the photocurable resin layer, so it may also adversely affect the device

Method used

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  • Sheet-shaped covering agent, covering method or manufacturing method of electronic device
  • Sheet-shaped covering agent, covering method or manufacturing method of electronic device
  • Sheet-shaped covering agent, covering method or manufacturing method of electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0174] Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited by these examples. In addition, the characteristic of the test piece obtained in the Example and the comparative example was measured by the following method.

[0175] [Viscoelasticity measurement]

[0176] For the test pieces of Examples and Comparative Examples, cut into width 5mm, length 50mm, use the dynamic viscoelasticity measuring device (TA INSTRUMENT JAPAN (Co., Ltd.) make, RSA-III), between chuck distance 20mm, heating rate 5 ℃ / The storage modulus (E') was measured under the condition of minute and angular frequency of 10 Hz.

[0177] [Molecular weight between crosslinks]

[0178] The molecular weight between the cross-linking points is substituted into the calculation formula of the molecular weight between the cross-linking points (G=(ρRT) / M x ) and calculated. It should be noted that the density ρ(g / m 3 ) is 1.02.

[0179] ...

Embodiment 1

[0215] The film obtained in Comparative Example 1 was irradiated with an electron beam at an accelerating voltage of 200 kV and a dose of 150 kGy using an electron beam irradiation device ("TYPE: CB250 / 15 / 180L" manufactured by Iwasaki Electric Co., Ltd.) at room temperature in a nitrogen atmosphere. Cross-linked to produce a film-shaped test piece with a thickness of 100 μm.

Embodiment 2

[0217] The film obtained in Comparative Example 1 was irradiated with an electron beam at an accelerating voltage of 200 kV and a dose of 250 kGy using an electron beam irradiation device ("TYPE: CB250 / 15 / 180L" manufactured by Iwasaki Electric Co., Ltd.) at room temperature in a nitrogen atmosphere. Cross-linked to produce a film-shaped test piece with a thickness of 100 μm.

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Abstract

The invention provides a sheet-like covering agent which can effectively cover (or seal) components to be processed such as electronic devices at a relatively low temperature. The soft polymer is loosely cross-linked, has a large molecular weight between cross-linking points, has a given storage modulus at low temperature and high temperature, and a polymer with a stress relaxation coefficient of 0.5-30% to form a sheet-like form. Covering (or sealing) of electronic parts and the like. The polymer has a storage modulus of 100-5000 MPa at a temperature of 25° C., a storage modulus of 0.01-10 MPa at a temperature of 80° C., and a molecular weight between crosslinking points of 8,000-30,000.

Description

technical field [0001] The present invention relates to a sheet-shaped covering agent (or cover sheet, etc.) useful for protecting elements (semiconductor elements, etc.) Sealant) and a covering method (or sealing method) using the same or a method of manufacturing an electronic device. Background technique [0002] Functional elements such as semiconductor elements, organic electroluminescent (EL) elements, liquid crystal elements (liquid crystal cells), photoelectric conversion elements (solar battery cells, etc.), and printed circuit boards on which these functional elements are packaged or mounted Components (or electronics) are usually sealed with resin to protect them from external influences (especially humidity). As a sealing method, a method of arranging a precision part in a cavity and injecting a thermosetting resin with low viscosity and high fluidity for sealing is known. However, due to the addition of additives such as crosslinking agents, thermosetting resi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J7/00B32B27/00B32B27/16H01L21/56H01L23/29H01L23/31H01L51/50H05B33/04
CPCH01L23/293H01L2924/0002
Inventor 梅本浩一伊藤久义
Owner DAICEL CHEM IND LTD