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Preparation method of eva thermally conductive composite adhesive film for photovoltaic encapsulation
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A heat-conducting composite and encapsulation adhesive film technology, which is applied in photovoltaic power generation, adhesives, semiconductor devices, etc., can solve problems such as PID failure, and achieve the effects of easy-to-obtain raw materials, simple preparation process, and excellent pid performance
Inactive Publication Date: 2016-01-27
NINGBO HUAFENG PACKAGE
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Problems solved by technology
The P-type photovoltaic modules of the traditional process basically have the problem of PID failure
Method used
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Embodiment 1
[0022] Prepare EVA thermal conductive composite film A, which is composed of the following parts by mass of raw materials:
[0028] The above-mentioned raw materials are mixed uniformly in proportion, and then the mixture is poured into an extruder for blending and extruding. The extrudate is cast, cooled, oven shaped, drawn, and rolled to obtain the EVA packaging film A.
Embodiment 2
[0030] Prepare EVA thermally conductive composite film B, which consists of the following parts by mass of raw materials:
[0036] The above-mentioned raw materials are mixed uniformly in proportion, and then the mixture is poured into an extruder for blending and extrusion. The extrudate is cast, cooled, oven shaped, hauled, and rolled to obtain the EVA encapsulating film B.
Embodiment 3
[0038] The adhesive performance and impact resistance of the EVA thermally conductive composite film prepared in Examples 1 and 2 were performed, and the results are shown in Table 1. Bonding performance is tested in accordance with the national standard GB / T2790 "Adhesive 180℃ peel strength test method, bypassing material to rigid material"; impact resistance is tested in accordance with "Toughened Glass" GB / T9963-1998 and the national standard "Building Curtain Wall" GB / T21086- The impactresistance test operation method specified in 2007 was tested.
[0039] The pid test was performed on the same components encapsulated by the packaging adhesive film of Example and 2 and the results are shown in Table 1.
[0040] Optional test method: under 80% humidity and 75°C, cover the surface of the module with copper foil and connect the positive electrode of 200V, connect the battery to the negative electrode, and test the battery efficiency after 72 hours.
[0041] Table 1
[0042]
[0043...
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Abstract
The invention relates to a method for preparing a piece of EVA heat conduction composite adhesive film used for photovoltaic packaging. Raw materials are evenly mixed in proportion, then the mixture is poured into an extruder for blending and extrusion, and the EVA packaging adhesive film is obtained after the extrudate is processed through the tape casting procedure, the cooling procedure, the oven sizing procedure, the traction procedure and the coiling procedure, wherein the raw materials are composed of 100 parts of copolymers of ethylenevinyl acetate, 0.6 part to 0.8 part of crosslinking curing agent, 0.3 part to 0.4 part of antioxidant, 0.5 part to 1 part of at least one type of compound of hydroxide radical benzophenone, and silicon dioxide, and the mass part ratio of silicon dioxide to the type of compound of hydroxide radical benzophenone is (3-5):1. The method is simple in process and low in cost, and the obtained packaging adhesive film has good adhesive performance, shock resistance and an excellent PID effect.
Description
Technical field [0001] The invention relates to a preparation method of an EVA thermally conductive composite adhesive film for photovoltaic packaging. Background technique [0002] In recent years, the reliability of photovoltaic cells and modules caused by PID effect (potential induced degradation) has received increasing attention. Companies are committed to the development of PID-free (not affected by the PID effect) cells and photovoltaic modules. The traditional P-type photovoltaic modules basically have the problem of PID failure. In order to effectively prevent the PID effect, it can be solved from three aspects: battery, component and system. The packaging material is an important factor. Therefore, the development of packaging materials capable of resisting the PID effect has become an important research direction in this field. [0003] The patent application with application number 201310689585 discloses a melamine-containing polyolefin encapsulating film for photov...
Claims
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