Aluminum-based composite heat dissipation material with low thermal impedance for LED

An aluminum-based composite, heat-dissipating material technology, applied in heat exchange materials, chemical instruments and methods, etc., can solve problems such as insufficient insulation performance, cost constraints, etc., to improve sintering performance, improve compatibility, and have a compact internal structure. sequential effect

Inactive Publication Date: 2014-11-12
BENGBU GAOHUA ELECTRONICS
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  • Abstract
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  • Claims
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Problems solved by technology

Existing LED heat dissipation materials are mainly made of metal materials such as aluminum and copper. In actual use, there are disadvantages such as cost limitations and insufficient insulatio

Method used

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Embodiment

[0011] The LED heat dissipation material in this embodiment is made of the following raw materials in parts by weight: aluminum 78, aluminum nitride 15, titanium dioxide 8, strontium carbonate 3, trimethylsiliconate sodium 3, polyacrylate sodium 5, oleylamine polyoxyethylene ether 3, Silicone resin 12, acetamide 0.2, additive 5.

[0012] The auxiliary agent is made of the following raw materials in parts by weight: 6 tung oil, 2 phenyl silicone oil, 5 zinc oxide nanowires, 2 silver nitrate, 8 carbon nanotubes, and 10 fine silica airgel. The preparation method is as follows: Dissolve silver nitrate in an appropriate amount of water to prepare an aqueous solution with a concentration of 8%, and put zinc oxide nanowires, carbon nanotubes, and fine silica aerogels into the solution, stir and disperse evenly, let stand for 8 hours, and then dry , The resulting material is then mixed with other remaining ingredients, stirred and dispersed for 3 hours, then concentrated and dried, an...

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Abstract

The invention relates to the lamp heat dissipation materials and specifically relates to an aluminum-based composite heat dissipation material with low thermal impedance for an LED and a production method thereof. The heat dissipation material is prepared from the following materials in parts by weight: 76-78 parts of aluminum, 12-15 parts of aluminum nitride, 8-10 parts of titanium dioxide, 1-3 parts of strontium carbonate, 2-3 parts of sodium trimethylsilanolate, 4-5 parts of sodium polyacrylate, 1-3 parts of oil amine polyoxyethylene ether, 10-12 parts of organic silicon resin, 0.2-0.4 part of acetamide and 4-5 parts of auxiliaries. The heat dissipation material disclosed by the invention is integrated with advantages of components such as aluminum, aluminum nitride, organic silicon resin, and the like, and also has good heat-conducting property and insulating property; the materials are grinded and dispersed in mixed aqueous liquor of sodium polyacrylate and acetamide, so that compatibility of the materials is improved; the auxiliaries are added, so that sintering performance of the mixed materials is improved; the heat dissipation material is compact and ordered in internal structure, smooth and compact in surface, quick in heat transmission and heat dissipation, low in thermal impedance, and capable of quickly lowering the temperature of the LED lamps so as to guarantee the lamps to efficiently and stably light, and thus, service lives of the LED lamps are prolonged.

Description

technical field [0001] The invention relates to a heat dissipation material for lamps, in particular to an aluminum-based composite heat dissipation material with low thermal resistance for LEDs and a production method thereof. Background technique [0002] LED is called the fourth-generation light source, which has the advantages of energy saving, environmental protection, safety, low energy consumption, and high brightness. It is widely used in daily life. The heat dissipation performance of the LED lamp itself is very important, which directly affects the service life of the lamp. and lighting effects. Existing LED heat dissipation materials are mainly made of metal materials such as aluminum and copper. In actual use, there are disadvantages such as cost limitations and insufficient insulation performance. Therefore, it is necessary to improve the formula of the material to achieve a better heat dissipation effect. , Improve the performance of lamps and prolong their se...

Claims

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Application Information

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IPC IPC(8): C22C21/00C22C1/05C09K5/14
Inventor 肖宪书文庆华张俊
Owner BENGBU GAOHUA ELECTRONICS
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