MEMS capacitive pressure sensor and manufacturing method thereof

Abstract

The invention relates to an MEMS capacitive pressure sensor. Holes are formed in an induction capacitor in a bridge circuit to manufacture a reference capacitor, the induction capacitor and the reference capacitor are almost the same in structure, consequently, the temperature coefficients of the two capacitors are consistent, the two capacitors are affected by temperature to the same degree, and an output detection signal of the bridge circuit is a differential signal, so that the detection signal output by the bridge circuit is not affected by temperature parameters. Automatic temperature correction for the detection signal is achieved in the bridge circuit part, and therefore the pressure sensor of the structure can accurately measure changes of outside air pressure, hydraulic pressure, water pressure and the like without arranging a temperature correction module. While the pressure sensor dispenses with the temperature correction module, the induction capacitor and the reference capacitor of the pressure sensor are stacked on an upper layer of an integrated basic circuit, and therefore the area of the pressure sensor is reduced substantially.

Description

【Technical field】 [0001] The invention relates to the field of micro-electromechanical systems, in particular to a capacitive pressure sensor capable of automatic temperature correction and a manufacturing method of the sensor. 【Background technique】 [0002] Microelectromechanical systems (MEMS for short) is a cutting-edge multidisciplinary research field developed on the basis of microelectronics technology. It is a technology that uses semiconductor technology to manufacture microelectromechanical devices. Compared with traditional electromechanical devices, MEMS devices have obvious advantages in high temperature resistance, small size, and low power consumption. After decades of development, it has become one of the world's major scientific and technological fields. It involves electronics, machinery, materials, physics, chemistry, biology, medicine and other disciplines and technologies, and has broad application prospects. [0003] As one of the MEMS devices, the pre...

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Problems solved by technology

[0005] In order to overcome the shortcomings of the temperature compensation module of the current capacitive pressure sensor, such as low precision, large volume, high cost, and poor compatibility of the existing capacitive pressure sensor, the present invention provides a small volume, capable of automatic temperature correction. Low cost, good compatibility capacitive pressure sensor and manufacturing method of the pressure sensor

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