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Preparation of polyborosiloxane and phenolic resin heat resistant modification method

A polyborosiloxane and phenolic resin technology, applied in the direction of aldehyde/ketone condensation polymer adhesives, adhesive types, adhesives, etc., can solve problems such as corrosion, achieve excellent high temperature resistance, improve resistance The effect of high temperature and bonding strength and easy operation

Inactive Publication Date: 2014-11-19
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] There are some problems in the above route: In the technical route (1), the reaction between halosilane and boric acid is used to generate HCl gas with a pungent smell, which is corrosive

Method used

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  • Preparation of polyborosiloxane and phenolic resin heat resistant modification method
  • Preparation of polyborosiloxane and phenolic resin heat resistant modification method
  • Preparation of polyborosiloxane and phenolic resin heat resistant modification method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Preparation of polyborosiloxane: Add 12.8 parts of boric acid, 81.6 parts of phenyltrimethoxysilane and 0.1 part of stannous dichloride to 30 parts of diglyme, under nitrogen atmosphere, within 2 hours Gradually raise the temperature from 90°C to 150°C, react for 1 hour, add 5.7 parts of hydroquinone, continue to react for 5 hours, and react under reduced pressure by water pump for 1.5-3 hours to obtain polyborosiloxane.

Embodiment 2

[0027] Preparation of polyborosiloxane: 12 parts of boric acid, 77.2 parts of phenyltrimethoxysilane, and 0.1 part of stannous chloride were added to 30 parts of diethylene glycol dimethyl ether, and within 2 hours under a nitrogen atmosphere Gradually raise the temperature from 90°C to 150°C, react for 1 hour, add 10.7 parts of hydroquinone, continue to react for 5 hours, and react under reduced pressure by water pump for 1.5-3 hours to obtain polyborosiloxane.

Embodiment 3

[0029] Preparation of polyborosiloxane: Add 10.9 parts of boric acid, 69.8 parts of phenyltrimethoxysilane, and 0.1 part of stannous dichloride to 30 parts of diglyme, and within 2 hours under a nitrogen atmosphere Gradually raise the temperature from 90°C to 150°C, react for 1 hour, add 19.4 parts of hydroquinone, continue to react for 5 hours, and react under reduced pressure by water pump for 1.5-3 hours to obtain polyborosiloxane.

[0030] The molecular weight and carbon residue rate at 800°C of the polyborosiloxane obtained in Examples 1-3 are shown in Table 1. It can be seen from the table that the polyborosiloxane obtained in Example 1 has the largest number average molecular weight and carbon residue rate at 800°C. With Ph(OH) 2 With the increase of content, the molecular weight and carbon residue rate decreased successively.

[0031] The molecular weight and carbon residue rate of polyborosiloxane obtained in table 1 embodiment 1-3

[0032]

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Abstract

The invention discloses preparation of polyborosiloxane and a phenolic resin heat resistant modification method; first organic siloxane is directly polycondensed with boric acid and polyhydric phenol for synthesis of polyborosiloxane, and the polyborosiloxane is mixed with base-catalyzed phenolic resin for modification to obtain a high temperature resistant modified phenolic resin adhesive.

Description

technical field [0001] The invention relates to the preparation of polyborosiloxane and a method for heat-resistant modification of phenolic resin. It specifically involves reacting organosiloxane with boric acid and polyphenol to synthesize polyborosiloxane, and modifying alkali-catalyzed phenolic resin to improve its heat resistance. technical background [0002] The price of phenolic resin is very low, the raw materials are easy to buy, and the production process and production equipment are simple. It has become one of the indispensable materials in the industrial sector and is widely used. The thermal stability and high temperature resistance of pure phenolic resin are not high enough, and a lot of research has been done on its modification to improve its heat resistance and bond strength. [0003] Polyborosiloxane (PBS) has excellent heat resistance. Some studies have used boric acid and organosilicon prepolymers to prepare polyborosiloxane, and used it for the modif...

Claims

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Application Information

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IPC IPC(8): C08G77/22C09J161/10C09J183/08
Inventor 赵京波赵红英
Owner BEIJING UNIV OF CHEM TECH