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A method of manufacturing barrier material-plated copper foil

A manufacturing method and technology for copper foil, applied in the field of copper foil manufacturing, can solve the problems of harsh technical conditions, difficulty in meeting environmental protection requirements, and uniformity problems, and achieve the effects of good coating quality, low cost and good processing quality.

Active Publication Date: 2014-11-19
AKM ELECTRONICS TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The Omega-ply company in the United States uses electroplating to plate a Ni-P alloy layer on the surface of copper foil, but the alloy layer plated by this method is easy to fall off, it is difficult to meet environmental protection requirements, and there is a problem of uniformity, which is directly related to the uniformity of thickness. to the resistance value
The Ticer company in the United States uses vacuum plating to plate a Ni-Cr alloy layer on the surface of copper foil, in which Cr accounts for 20%-30%, and the square resistance that can be achieved is similar to the above, but vacuum plating has strict requirements on technical conditions and high cost.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A method for manufacturing a copper foil coated with a resistive material, comprising the steps of:

[0027] a. On the non-plating surface of the copper foil, paste a layer of isolation film as a protective layer. The isolation film is a photosensitive dry film or a micro-adhesive film; the copper foil and the isolation film are bonded by roll-to-roll.

[0028] b. Pretreatment of the plated surface of the copper foil: degreasing and pickling of the copper foil, then immersing the copper foil in a microetching solution for microetching, and then activating and acid attacking the microetched copper foil, Finally, wash the copper foil with water and dry it for later use.

[0029] c. A resistive material layer is plated on the plated surface of the copper foil by electroless plating; wherein:

[0030] The chemical plating solution used includes: nickel sulfate 20g / L, sodium hypophosphite 25g / L, sodium citrate 20g / L, glycine 10g / L, sodium acetate pentahydrate 4g / L, lead ace...

Embodiment 2

[0035] A method for manufacturing copper foil plated with resistive material. The manufacturing method of this embodiment is basically the same as that of Embodiment 1, the difference is that:

[0036] The chemical plating solution used includes: nickel sulfate 22g / L, sodium hypophosphite 27g / L, sodium citrate 25g / L, glycine 15g / L, sodium acetate pentahydrate 6g / L, lead acetate 0.3PPM and EDTA salt 10g / L L.

[0037] The thickness of the obtained Ni-P alloy layer is 0.1 μm; the mass proportion of P is 14%.

Embodiment 3

[0039] A method for manufacturing copper foil plated with resistive material. The manufacturing method of this embodiment is basically the same as that of Embodiment 2, the difference is that:

[0040] In the process of electroless plating: the temperature is controlled at 80° C., the deposition rate of the coating is 0.01-0.02 μm / min, and the pH value is controlled at 3.5-4.5.

[0041] By adopting the manufacturing method of this embodiment, it can be obtained that the mass ratio of P in the Ni—P alloy layer is 13%.

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PUM

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Abstract

The present invention provides a method of manufacturing barrier material-plated copper foil, in which the unplated surface of copper foil is provided with a protective layer, copper foil is pretreated, and the copper foil is plated with an impedance material layer finally by means of chemical plating. By sticking a sensitive dry film or slightly viscoelastic film onto the unplated surface, or arranging barrier material as a protective layer through plating, the unplated surface can be protected, so that no error occurs in subsequent processes, and the quality of subsequent processing of the unplated surface can be higher. Pretreating the surface to be plated makes the quality of the plating made in a chemical way higher. The barrier material is arranged through chemical plating, so that the process is easy and convenient, and the plating is uniform and stable, which requires relatively simple technical conditions at low cost.

Description

technical field [0001] The invention relates to copper foil applied in the field of PCB, in particular to a manufacturing method of copper foil plated with resistive material. Background technique [0002] The copper foil on the circuit board generally requires surface treatment, that is, an alloy layer is often plated on the surface that contacts the PI. The thickness of copper foil is usually only 9-35μm, and it is very difficult to coat only one side of it. The Omega-ply company in the United States uses electroplating to plate a Ni-P alloy layer on the surface of copper foil, but the alloy layer plated by this method is easy to fall off, it is difficult to meet environmental protection requirements, and there is a problem of uniformity, which is directly related to the uniformity of thickness. to the resistance value. The Ticer company in the United States uses vacuum plating to plate a Ni-Cr alloy layer on the surface of copper foil, in which Cr accounts for 20%-30%. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/36
Inventor 崔成强
Owner AKM ELECTRONICS TECH SUZHOU
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