Substrate for power module and manufacturing method thereof

A technology for power modules and manufacturing methods, applied in manufacturing tools, printed circuit manufacturing, chemical instruments and methods, etc., can solve problems such as peeling off of ceramic substrates and metal plates, prevent peeling, improve bonding reliability, and reduce anisotropy Effect

Active Publication Date: 2017-07-28
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In such a substrate for a power module, microscopic voids sometimes occur at the solder joint between the ceramic substrate and the metal plate. Delamination occurs at the joint interface with the metal plate

Method used

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  • Substrate for power module and manufacturing method thereof
  • Substrate for power module and manufacturing method thereof
  • Substrate for power module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0062] In order to confirm the effects of the present invention, the following experiments were conducted.

[0063] A rolled material made of 1N99 aluminum with a thickness of 0.6 mm was punched out into 30 mm×30 mm, etched or blasted as shown in Table 1, and the removal depth of the metal plate surface by this treatment was measured. The removal amount was calculated from the difference between the weight before treatment and the weight after treatment of the metal plate, and the removal depth was obtained from the relationship between the removal amount and the specific gravity and area of ​​the metal plate.

[0064] Also, for the metal plate with the treated surface, the oxygen concentration is analyzed by the number of oxygen meters measured with an electron probe microanalyzer (EPMA) at an accelerating voltage of 10kV, a current of 100mA, and a beam diameter of 100μm, and X-rays in the thickness direction Photoelectron spectroscopy (XPS) was used to determine the oxide th...

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Abstract

The present invention provides a substrate for a power module that prevents peeling by reducing minute voids in a junction and a method for manufacturing the same. The substrate for the power module is formed by bonding a metal plate made of aluminum or an aluminum alloy to at least one side of the ceramic substrate by brazing, and a scanning electron microscope is used to scan the area from the side of the metal plate to a width of 200 μm with a magnification of 3000. When the cross-section of the metal plate is observed from the joint interface between the metal plate and the ceramic substrate to a depth of 5 μm, the total length of continuous residual oxides of 2 μm or more continuously present along the joint interface is 70% or less with respect to the length of the field of view.

Description

technical field [0001] The present invention relates to a substrate for a power module constituting a power module controlling a large current and a high voltage, and a manufacturing method thereof. [0002] This application claims priority based on Patent Application No. 2012-077401 for which it applied in Japan on March 29, 2012, and uses the content here. Background technique [0003] Conventionally, as a semiconductor device that controls a large current and a high voltage, a power module having a structure in which electronic components such as a semiconductor chip are mounted on a power module substrate is known. As a method of manufacturing a power module, methods described in Patent Document 1 and Patent Document 2 are known, for example. In these manufacturing methods, first, a metal plate to be a circuit layer is laminated on one side of a ceramic substrate with a solder, and a metal plate to be a heat dissipation layer is laminated on the other side of a ceramic ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/13H05K1/02
CPCH01L23/3735H01L23/3736H01L23/473C04B37/026C04B2235/6581C04B2235/963C04B2237/121C04B2237/126C04B2237/128C04B2237/366C04B2237/402C04B2237/52C04B2237/60C04B2237/704C04B2237/706C04B2237/708C04B2237/86H01L2224/48091H01L2224/73265B32B18/00H05K3/382H05K3/383C04B2235/723H05K1/0306C04B2237/064C04B2237/592C04B2237/72H01L2924/00014B23K1/0016B32B15/04B23K1/19B32B2457/00
Inventor 长濑敏之北原丈嗣村中亮
Owner MITSUBISHI MATERIALS CORP
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