Heat pump device, air conditioner, and cooling machine
A heat pump device and refrigerant technology, applied in the fields of heat pump devices, air conditioners and refrigerators, can solve the problems of not considering the output change of the rotor stop position, high frequency and low voltage records, unable to obtain the heating capacity of the compressor, etc., and achieve stability. And the effect of high-efficiency heating output, reducing bearing vibration and noise
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Embodiment approach 1
[0066] figure 1It is a figure which shows the structural example of Embodiment 1 of the heat pump apparatus concerning this invention. The heat pump device 100 of the present embodiment includes a refrigeration cycle in which a compressor 1 , a four-way valve 2 , a heat exchanger 3 , an expansion mechanism 4 , and a heat exchanger 5 are sequentially connected by a refrigerant pipe 6 . Inside the compressor 1 are provided a compression mechanism 7 that compresses the refrigerant, and a motor 8 that drives the compression mechanism 7 . The motor 8 is a three-phase motor having U-phase, V-phase, and W-phase three-phase windings.
[0067] An inverter 9 that applies a voltage to drive the motor 8 is electrically connected to the motor 8 . The inverter 9 uses a DC voltage (bus voltage) Vdc as a power source, and applies voltages Vu, Vv, and Vw to the U-phase, V-phase, and W-phase windings of the motor 8, respectively. In addition, the inverter control unit 12 is electrically con...
Embodiment approach 2
[0113] Next, a heat pump device according to Embodiment 2 of the present invention will be described. The configuration of the heat pump device 100 of this embodiment is the same as that of the first embodiment. Hereinafter, parts different from Embodiment 1 will be described.
[0114] In the heat pump device of this embodiment, figure 2 The switching elements 21a to 21f shown are switching elements of silicon carbide elements (hereinafter referred to as SiC elements) which are wide bandgap semiconductor elements. Figure 11 It is a graph showing the relationship between the withstand voltage and the on-resistance of Si elements and SiC elements. Currently, the mainstream is generally to use a semiconductor made of silicon (Si). Such as Figure 11 As shown, compared with the Si element, it can be seen that the SiC element has a larger band gap, and the balance between the withstand voltage and the on-resistance can be greatly improved. For example, cooling devices and co...
Embodiment approach 3
[0119] Figure 12 It is a figure which shows the structural example of Embodiment 3 of the heat pump apparatus concerning this invention. In this embodiment, an example of the configuration and operation when the heat pump device described in Embodiments 1 and 2 is installed in an air conditioner, heat pump water heater, refrigerator, refrigerator, or the like will be described.
[0120] Figure 13 is about Figure 12 A Mollier diagram of the states of the refrigerant in the heat pump unit shown. exist Figure 13 In , the horizontal axis represents the specific enthalpy, and the vertical axis represents the refrigerant pressure.
[0121] In the heat pump device of this embodiment, the compressor 51, the heat exchanger 52, the expansion mechanism 53, the receiver 54, the internal heat exchanger 55, the expansion mechanism 56, and the heat exchanger 57 are sequentially connected by piping to form a refrigerant cycle. The main refrigerant circuit 58. In addition, in the mai...
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