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Homotropic conductive adhesive film and preparation method thereof

A conductive adhesive film and isotropic technology, applied in the field of conductive adhesive, can solve the problems of low bonding strength and poor heat resistance, and achieve the effects of low initial viscosity, excellent heat resistance and stable mechanical energy.

Active Publication Date: 2016-03-09
SHENZHEN DOVER TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing homotropic conductive adhesive film generally has technical problems such as low bonding strength and poor heat resistance after hot-press curing.

Method used

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  • Homotropic conductive adhesive film and preparation method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0023] The preparation method of the above-mentioned homotropic conductive adhesive film has the following steps:

[0024] (1) Preparation of glue

[0025] Mix 3-7 parts of liquid epoxy resin, 8-20 parts of solid epoxy resin with 50% solid content, 0-4 parts of modified epoxy resin and 0.5 parts of γ-(2,3-glycidoxy) propyl Mix trimethoxysilane evenly, then add 15 parts of butyl acetate, then add 83 parts of flaky silver powder (diameter 6-9um), disperse the above mixture evenly at high speed, finally add 1-4 parts of curing agent, stir evenly, and make a glue liquid.

[0026] (2) Coating film formation

[0027] Coat the glue solution in the above examples on the PET release film by a coating machine. After coating, cut the PET release film into slices and bake in a 60-80°C oven for 10-30 minutes. Minutes, that is, to complete the isotropic conductive adhesive film of the present embodiment by baking.

Embodiment 1

[0030] The homotropic conductive adhesive film of embodiment 1 is made from the raw material of following parts by weight: 83 parts of flaky silver powder (diameter 6-9um), the solid epoxy resin of 20 parts of 50% solid content, 15 parts of butyl acetate, 0.5 Parts of γ-(2,3-epoxypropoxy)propyltrimethoxysilane, 3 parts of liquid epoxy resin, 4 parts of rubber-modified epoxy resin, 1 part of amine curing agent, and 0.4 parts of imidazole curing agent.

[0031] The preparation method of the above-mentioned homotropic conductive adhesive film has the following steps:

[0032] (1) Preparation of glue

[0033] First add 4 parts of rubber-modified epoxy resin to 3 parts of liquid epoxy resin, then add 0.5 parts of γ-(2,3-glycidoxy)propyltrimethoxysilane, heat and stir to mix, dissolve and cool , then add 20 parts of solid epoxy resin with 50% solid content, then add 15 parts of butyl acetate, stir and mix evenly, then add 83 parts of flaky silver powder (diameter 6-9um), stir and m...

Embodiment 2

[0037] The homotropic conductive adhesive film of embodiment 2 is made from the raw material of following parts by weight: 83 parts of flaky silver powder (diameter 6-9um), the solid epoxy resin of 16 parts of 50% solid content, 15 parts of butyl acetate, 0.5 Parts of γ-(2,3-epoxypropoxy)propyltrimethoxysilane, 5 parts of liquid epoxy resin, 4 parts of rubber-modified epoxy resin, 1 part of amine curing agent, and 0.4 parts of imidazole curing agent.

[0038] The preparation method of the above-mentioned homotropic conductive adhesive film has the following steps:

[0039] (1) Preparation of glue

[0040] First add 4 parts of rubber modified epoxy resin to 5 parts of liquid epoxy resin, then add 0.5 parts of γ-(2,3-epoxypropoxy)propyltrimethoxysilane, heat and stir to mix, dissolve and cool , then add 16 parts of solid epoxy resin with 50% solid content, then add 15 parts of butyl acetate, stir and mix evenly, then add 83 parts of flaky silver powder (diameter 6-9um), stir an...

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Abstract

The invention relates to a homeotropic orientation conductive adhesive film and a preparation method thereof. The homeotropic orientation conductive adhesive film is prepared from the following raw materials in parts by weight: 83 parts of conductive particles, 8-20 parts of a solid epoxy resin solution, 15 parts of an organic solvent, 3-7 parts of liquid epoxy resin, 1-4 parts of a solidifying agent, 0-4 parts of modified epoxy resin and 0.5 part of a silane coupling agent. According to the homeotropic orientation conductive adhesive film disclosed by the invention, by the adoption of solid and liquid resin mutual matching scheme, a liquid adhesive can successfully form the film after a solvent is volatilized; furthermore, epoxy system resin is used as a raw material of the homeotropic orientation conductive adhesive film, so that the homeotropic orientation conductive adhesive film is stable in mechanical property, high in sticking intensity and favorable in heat resistance.

Description

technical field [0001] The invention relates to a conductive glue used in the electronics industry, in particular to a homotropic conductive glue film and a preparation method thereof. Background technique [0002] With the development of the electronics industry, electronic assembly is becoming more and more miniaturized and high-density. Many conductive connections no longer rely on traditional methods such as welding or plugging, but are realized through conductive adhesive films. [0003] Homotropic conductive adhesive film is a compound formed by dispersing conductive particles in adhesive insulating resin, which is used for bonding components and cured under heat and pressure, so as to realize the functions of electricity and bonding. The same sex conductive adhesive film is mainly composed of resin, curing agent and silver powder, and the resin is generally solid resin and liquid resin. The solid resin is mainly used for pre-curing to form a film, and the liquid resi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/02C09J163/00C09J9/02
Inventor 雷发周珍泉宋家炎
Owner SHENZHEN DOVER TECH
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