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Poly(amide-imide) copolymer, composition for thin film and thin film

A technology of imide and copolymer, applied in the field of film composition and film and copolymer, can solve the problems of scratches or breakage on the surface of the film, poor optical properties, insufficient film hardness, etc., and achieve good light transmittance. Effect

Active Publication Date: 2020-12-15
DAXIN MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a film formed of polyimide has a problem of insufficient hardness
For example, the pencil hardness of a film formed of polyimide is generally lower than 3B, which may cause damage such as scratches or breaks on the surface of the film, thereby affecting the performance of the device using the film.
In addition, in recent years, although poly(amide-imide) copolymers have been developed to form thin films, the films formed by these poly(amide-imide) copolymers still have the problem of poor optical properties.

Method used

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  • Poly(amide-imide) copolymer, composition for thin film and thin film
  • Poly(amide-imide) copolymer, composition for thin film and thin film
  • Poly(amide-imide) copolymer, composition for thin film and thin film

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0056]

[0057] The aromatic diamine monomer (a1) and the tetracarboxylic dianhydride monomer (a3) ​​can first undergo a polymerization reaction to form a polyamic acid. Then, add alkoxy-containing silane compound (a4) and diacid chloride monomer (a2), and undergo hydrolysis condensation reaction to form poly(amic acid) comprising amic acid structural unit and amide structural unit and having a silane terminal structure -amide) copolymers. Then, the amic acid structural unit in the poly(amic acid-amide) copolymer undergoes a dehydration cyclization reaction to form a poly(amide-imide) comprising an amide structural unit and an imide structural unit and having a silane terminal structure. ) copolymer.

[0058] The polymerization reaction, hydrolysis condensation reaction and dehydration cyclization reaction can be carried out in the presence of a solvent. The solvent is, for example, N-methylpyrrolidone, but the present invention is not limited thereto, and other solvents c...

Synthetic example 1

[0145] When nitrogen is fed into the 1 liter reactor equipped with agitator, nitrogen injection device, dropping funnel, temperature regulator and condenser tube, 669g of N-Methyl-2-Pyrrolidone (N-Methyl-2-Pyrrolidone , NMP) into the reactor. Next, after setting the temperature of the reactor to 25° C., 53.49 g (0.167 moles (mol)) of 2,2′-bis(trifluoromethyl)diaminobiphenyl (TFMB) was dissolved in NMP, and The resulting solution was maintained at 25°C. Then, 2.59g (0.009mol) of 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), 11.72g (0.026mol) of 4,4'-(hexafluoroisopropene) di Phthalic anhydride (6FDA) and 6.90 g (0.035 mol) of 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA) were stirred for 2 to 4 hours to dissolve and react. Next, the temperature of the solution was maintained at 0-5° C., and then 3.89 g (0.018 mol) of 3-aminopropyltriethoxysilane (APTES) was added and stirred evenly. Afterwards, 19.63g (0.097mol) of terephthaloyl chloride (TPC) and 1.78g (0.00...

Synthetic example 2～15

[0148] The preparation methods of Synthesis Examples 2-15 are the same as those of Synthesis Example 1 except for changing the usage amount and type of each component. The composition, usage amount and weight average molecular weight of each synthesis example are listed in Table 1.

[0149]

[0150] In Table 1, the abbreviations are as follows:

[0151] PAI: poly(amide-imide) copolymer

[0152] PA: polyamide

[0153] PI: polyimide

[0154] TFMB: 2,2’-bis(trifluoromethyl)diaminobiphenyl

[0155] ODA: 4,4'-diaminodiphenyl ether (4,4'-diaminodiphenyl ether)

[0156] FDA: 9,9-bis(4-aminophenyl)fluorene (9,9-bis(4-aminophenyl)fluorene)

[0157] APTES: 3-Aminopropyltriethoxysilane

[0158] APTMS: 3-Aminopropyltrimethoxysilane

[0159] Alink25: 3-isocyanatopropyltriethoxysilane

[0160] CBDA: 1,2,3,4-cyclobutanetetracarboxylic dianhydride

[0161] 6FDA: 4,4'-(hexafluoroisopropylene) diphthalic anhydride

[0162] BPDA: 3,3’,4,4’-Biphenyltetracarboxylic dianhydride

[016...

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Abstract

A poly(amide-imide) copolymer, a composition for a thin film, and a thin film are provided. The poly(amide-imide) copolymer is synthesized by polymerization, dehydration cyclization, and hydrolysis condensation of an aromatic diamine monomer, a diacyl chloride monomer, a tetracarboxylic dianhydride monomer, and a silane compound having an alkoxy group as an end-capping agent. The aromatic diaminemonomer includes 2,2'-bis(trifluoromethyl)benzidine. Based on a usage amount of 100 mol % of the aromatic diamine monomer, a usage amount of the 2,2'-bis(trifluoromethyl)benzidine is 70 mol % or more.

Description

【Technical field】 [0001] The present invention relates to a copolymer, a film composition and a film, and in particular to a poly(amide-imide) copolymer, a film composition and a film. 【Background technique】 [0002] Polyimide (PI) has excellent heat resistance, mechanical properties, and electrical properties, so it is often used as molding materials, electronic materials, optical materials, etc., and is widely used in various fields. However, a film formed of polyimide has a problem of insufficient hardness. For example, the pencil hardness of a film formed of polyimide is generally lower than 3B, which may cause damage such as scratches or breaks on the surface of the film, thereby affecting the performance of the device using the film. In addition, although poly(amide-imide) copolymers have been developed to form thin films in recent years, the films formed from these poly(amide-imide) copolymers still have the problem of poor optical properties. 【Content of invention...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/14C08L79/08C08J5/18
CPCC08G73/14C08J5/18C08J2379/08C08G73/1078C08G73/1017C08L2203/16C08G73/106C08G73/1064C08G73/1039C08L79/08C08K5/34924
Inventor 陈冠萍林典庆高敏慈
Owner DAXIN MATERIALS
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