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Beam membrane structure high-voltage electrostatic field sensor chip based on voltage-sensitive principle

A high-voltage electrostatic field and sensor chip technology, applied in the direction of electrostatic field measurement, etc., can solve the problems of inability to realize mass production, low frequency or low sensitivity of electrostatic field, sensor provision, etc., to improve the effect of stress concentration in sensitive areas and measurement sensitivity Improvement, the effect of low single cost

Inactive Publication Date: 2014-12-24
XI AN JIAOTONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the electrostatic field, the electric field cannot provide continuous energy to the sensor, and the charge on the high-voltage conductor cannot continue to maintain macroscopic motion. This has become a difficult point in the measurement of the electrostatic field, making the current electric field sensor less sensitive to low-frequency or electrostatic fields.
At the same time, the current sensors that can be used to measure high-voltage electrostatic fields have disadvantages such as complex structure, large volume, and high cost, and cannot be mass-produced
During the operation of the power system or electrical laboratory, a large number of non-contact indirect measuring instruments are required to monitor the accident-prone points of the high-voltage busbar on-line to ensure the safety of operators and electronic equipment. Therefore, the existing electric field Sensors cannot meet this requirement

Method used

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  • Beam membrane structure high-voltage electrostatic field sensor chip based on voltage-sensitive principle
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  • Beam membrane structure high-voltage electrostatic field sensor chip based on voltage-sensitive principle

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Embodiment Construction

[0021] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0022] refer to figure 1 , a beam film structure high-voltage electrostatic field sensor chip based on the principle of pressure sensitivity, comprising a base 3, a silicon structure layer 2 is arranged on the base 3, an upper pole plate 1 is arranged on the silicon structure layer 2; the upper surface of the base 3 The lower surface of the silicon structure layer 2 is connected by anodic bonding, and the upper surface of the silicon structural layer 2 is connected with the lower surface of the upper plate 1 by anodic bonding.

[0023] refer to figure 2 , the upper plate 1 is an electrode formed by depositing metal on the glass plate 1-1, and a rectangular fixed metal film electrode 1-2 is arranged in the middle area of ​​the lower surface of the glass plate 1-1, and the fixed metal film electrode 1-2 is A first electrode connection pad 1-4 is arranged beside the ...

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Abstract

The invention relates to a beam membrane structure high-voltage electrostatic field sensor chip based on the voltage-sensitive principle. The beam membrane structure high-voltage electrostatic field sensor chip comprises a substrate, a silicon structure layer is arranged on the substrate, and an upper pole plate is arranged on the silicon structure layer. The upper surface of the substrate is connected with the lower surface of the silicon structure layer in an anodic bonding mode, the upper surface of the silicon structure layer is connected with the lower surface of the upper pole plate in an anodic bonding mode, the electrostatic field force is measured according to the piezoresistance principle, and the electrostatic field intensity is accordingly obtained. The beam and membrane combining mode is adopted, so that the measuring sensitivity is greatly improved; a mass block is not arranged on a central membrane of the chip, the thickness is small, a force bearing membrane is supported by four beams, the structural stiffness is improved, the frequency response of the sensor chip is high, connection is simple, resistor stripes and leads are easily distributed, the structure is stable, the manufacturing process is mature, the reliable packaging method is adopted, and therefore the chip can be suitable for various different environments. The chip is low in unit cost after volume production is achieved; in addition, connecting and installing are easily and conveniently achieved, and the chip is suitable for large-scale application in an industrial site.

Description

technical field [0001] The invention relates to the technical field of micro-electromechanical systems (MEMS) high-voltage electrostatic field sensors; in particular, it relates to a beam-membrane structure high-voltage electrostatic field sensor chip based on the principle of pressure sensitivity. Background technique [0002] High-voltage power capacitors are widely used in power systems and test stations. Because the charge stored in capacitors is in a static state, it is difficult to be sensed by general measurement methods, including electromagnetic induction, magnetic field measurement and other principles and methods. At present, it is used for high-voltage electrostatic induction The devices and products tested, including rotating vane type and vibrating capacitive electrostatic measuring devices, are technically and economically difficult to apply to high-voltage capacitors equipped in large quantities in the power sector due to their volume, large power consumption,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R29/12
Inventor 赵玉龙白民宇耿英三翟小社
Owner XI AN JIAOTONG UNIV