Electroplating process for copper wires

An electroplating treatment and process technology, applied in the field of electroplating treatment technology, can solve the problems of high pretreatment requirements and low current efficiency, and achieve the effects of low pretreatment requirements, low power consumption and strong dispersion ability.

Inactive Publication Date: 2015-01-14
MINGGUANG XUSHENG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This technical solution is more sensitive to impurities and has higher requirements for pretreatment, and the current efficiency is only about 60%. This technical solution needs to be improved

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] An electroplating treatment process for copper wire, comprising the following steps:

[0027] (1) Degreasing, sodium hydroxide: 20g / L, sodium carbonate: 12g / L, sodium nitrate: 20g / L, temperature: 80°C, duration: 13 minutes;

[0028] (2) running water cleaning;

[0029] (3) drying;

[0030] (4) Electroplating treatment, the electrolyte is: sodium stannate: 15g / L, stannous fluoroborate: 20g / L, fluoroboric acid: 16g / L, ethylene glycol: 3g / L, sodium perborate: 5.4g / L , Hydrogen peroxide: 16mL / L, temperature: 70℃, current density: 4A / dm 2 ;

[0031] (5) Washing with water, temperature: 50°C;

[0032] (6) Dry and pack.

Embodiment 2

[0034] An electroplating treatment process for copper wire, comprising the following steps:

[0035] (1) Degreasing, sodium hydroxide: 22g / L, sodium carbonate: 14g / L, sodium nitrate: 22g / L, temperature: 84°C, duration: 12 minutes;

[0036] (2) running water cleaning;

[0037] (3) drying;

[0038] (4) Electroplating treatment, the electrolyte is: sodium stannate: 16g / L, stannous fluoroborate: 22g / L, fluoroboric acid: 17g / L, ethylene glycol: 2.5g / L, sodium perborate: 5g / L , hydrogen peroxide: 14mL / L, temperature: 72℃, current density: 4.2A / dm 2 ;

[0039] (5) Washing with water, temperature: 47°C;

[0040] (6) Dry and pack.

Embodiment 3

[0042] An electroplating treatment process for copper wire, comprising the following steps:

[0043] (1) Degreasing, sodium hydroxide: 20g / L, sodium carbonate: 12g / L, sodium nitrate: 24g / L, temperature: 80°C, duration: 10 minutes;

[0044] (2) running water cleaning;

[0045] (3) drying;

[0046] (4) Electroplating treatment, the electrolyte is: sodium stannate: 18g / L, stannous fluoroborate: 24g / L, fluoroboric acid: 16-g / L, ethylene glycol: 2g / L, sodium perborate: 4.2g / L, hydrogen peroxide: 16mL / L, temperature: 70-℃, current density: 4A / dm 2 ;

[0047] (5) Washing with water, temperature: 48°C;

[0048] (6) Dry and pack.

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PUM

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Abstract

The invention discloses an electroplating process for copper wires. The process comprises the following steps: (1) deoiling; (2) cleaning with running water; (3) baking; (4) electroplating; (5) carrying out water washing; (6) carrying out spin-drying, and packaging. According to the process, the requirements on pretreatment are low, the dispersing power is strong, and the current efficiency reaches over 95%; during electroplating, no precipitate is generated, and the consumption of electric energy is low; after electroplating, the combining power of a plated layer with a copper wire base body is good, and the plated layer is fine, purely white and glossy, so that the electroplating effect is good, and the service life is longer.

Description

technical field [0001] The invention relates to an electroplating treatment process for copper wires. Background technique [0002] The silver-plated copper wire is made by concentrically plating the silver layer on the copper core. It combines the characteristics of the two metals, has good electrical conductivity, and has a bright and shiny surface, and the silver layer has a high resistance to resistance. Corrosive, it is also widely used in high-end electronic components as a lead wire. [0003] Although the silver layer has strong corrosion resistance, when exposed to air for a long time, the surface of the silver-plated copper wire is easy to interact with sulfides and halides in the air, causing the surface to be discolored in an all-round way, which not only changes the appearance, but also makes The contact resistance increases and the brazing performance deteriorates. It has been found by experiments that the essence of the discoloration of the silver-plated laye...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/30C25D5/34C25D7/06
CPCC25D3/30C25D5/34C25D7/0607
Inventor 栾信清
Owner MINGGUANG XUSHENG TECH
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