Compound optical sensor and manufacture method and use method thereof

Abstract

The invention discloses a compound optical sensor and a manufacture method and a use method thereof. The compound optical sensor comprises a light source, a transparent substrate, a first pixel array area, a second pixel array area and a third pixel array area, wherein the transparent substrate is provided with a first surface and a second surface, and the first surface and the second surface are opposite; the first pixel array area is positioned on a first surface and is used for receiving the ray, which is reflected by external objects, of the light source; the second pixel array area is positioned on the first surface and is used for receiving the ray, which is reflected by a fingerprint, of the light source; and the third pixel array area is positioned on the first surface and is used for receiving visible light ray emitted from environment. The compound optical sensor exhibits simplified structure and low manufacture process difficulty, application functions are increased, and production cost is lowered.

Description

technical field [0001] The invention relates to the field of optical sensors, in particular to a composite optical sensor and a method for making and using the same. Background technique [0002] Consumer electronic devices, such as mobile phones and tablets, are using more and more sensors to enhance the perception of various environmental parameters. Fingerprint sensors, ambient light sensors, and distance sensors have been widely used. [0003] The principle of ambient light sensor is as follows figure 1 As shown, the visible light 101 in the normal environment enters the interior of the ambient light sensor from the outside, and the visible light 101 is detected by a photosensitive element 102 (eg, a photodiode) inside the environmental sensor. The photocurrent generated by the photosensitive element 102 is proportional to the light intensity it receives. Another semiconductor chip (not shown) detects the photocurrent generated by the photosensitive element 102 and di...

AI Technical Summary

Problems solved by technology

But the focused optical fingerprint sensor has a big disadvantage: the thickness of the focused optical fingerprint sensor is usually large

[0008] 1. From a structural point of view: multiple sensors are independent, and components such as power supply, communication interface, and light source of each sensor cannot be shared, and multiple sets of components are required to support them, which complicates the structure and increases production costs; at the same time, Multiple independent sensors will inevitably occupy more space inside electronic products, which is not conducive to the development of electronic products towards miniaturization and portability

[0009] 2. From the point of view of the manufacturing process: multiple sensors are manufactured independently, the process steps are many and cumbersome, and the packaging needs to be carried out step by step, which is easy to influence or even destroy each other, which increases the difficulty of the process and reduces the production yield; at the same time, the complexity The manufacturing process and packaging process prolong the process time, reduce production efficiency, and also cause an increase in production costs

[0010] 3. From the application point of view: multiple sensors are independent, the information collected by each sensor is not related to each other, cannot be shared, or has no meaning of sharing, the function of each sensor is single, there is no synergy, and the application value is low

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