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Integrated wet corrosion equipment used for manufacturing graph substrate

A technology of wet etching and graphic substrate, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problem of no special equipment for GaN graphic substrate, and achieve the effect of speeding up the process

Inactive Publication Date: 2015-02-11
PEKING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide an integrated wet etching equipment for preparing graphic substrates, so as to solve the requirement that there is no special equipment for the existing wet etching GaN graphic substrates

Method used

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  • Integrated wet corrosion equipment used for manufacturing graph substrate
  • Integrated wet corrosion equipment used for manufacturing graph substrate
  • Integrated wet corrosion equipment used for manufacturing graph substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] Example 1: A circular corrosion tank wet corrosion equipment (see figure 2 )

[0059] The device uses a drop-down operation panel (see Figure 8C ).

[0060] The corrosion area of ​​the equipment is 55cm long and 40cm wide. It is composed of 6 corrosion tanks. The corrosion tank is made of quartz. It is divided into two large corrosion areas with a baffle (the position near the operator is the front, and the position far away from the operator is the rear. And the length and width of the corroded area of ​​the equipment can be adjusted as required, the above data is the minimum size). The back zone is a high and low temperature acid corrosion tank, the left is a high temperature acid corrosion tank, and the right is a low temperature acid corrosion tank (the left and right corrosion tanks are interchangeable). The left side of the front area is the BOE corrosion tank, the middle is the deionized water cleaning tank, the upper right is the acetone tank, and the lower right...

Embodiment 2

[0062] Example 2: Circular corrosion tank with glove box wet corrosion equipment

[0063] The structure of the second embodiment is the same as that of the first embodiment. The difference is that the operation panel of the equipment is designed as a split type operation protection panel and a pull-down type operation protection panel, but can also be designed as a glove box type (see Figure 8, which can be opened. Use split or pull-down). In the process of preparing the pattern substrate by the wet method, the operator can put the whole arm into the glove for operation. The hole opening on the panel should be large to ensure that the single arm can corrode the innermost part of the corrosion zone when the single arm is deep. Carry out operation, better protect the operator. This circular corrosion tank with glove box wet corrosion equipment can be selected according to needs.

[0064] The size of the corrosion area, the size of the corrosion tank and the size of the corrosion su...

Embodiment 3

[0066] Embodiment 3: Rectangular corrosion tank body wet corrosion equipment.

[0067] The structure of Example 3 is the same as that of Example 1, except that the high and low temperature acid corrosion tank, BOE corrosion tank, and deionized water cleaning tank in the wet etching zone are all rectangular. The corrosion table space can be effectively used; the corrosion area size, corrosion tank size and corrosion support size are changed to:

[0068] The corrosion area of ​​the equipment is 220cm long and 160cm wide. It is composed of 6 corrosion tanks. The corrosion tank is made of quartz. It is divided into two large corrosion areas by a baffle (the position near the operator is the front, and the position far away from the operator is the rear. And the length and width of the corroded area of ​​the equipment can be adjusted as required, the above data is the minimum size). The back zone is a high and low temperature acid corrosion tank, the left is a high temperature acid cor...

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Abstract

The invention relates to an integrated wet corrosion equipment used for manufacturing a graph substrate. The equipment comprises a control unit, a graph substrate manufacturing unit which comprises a high and low temperature sour rot module, a graph mask manufacturing module and a cleaning module. According to the equipment, a BOE corrosion groove in special design is introduced, firstly, the graphical manufacturing function of a patter mask is realized functionally, according to the manufacturing technology characteristics, a special-purpose corrosion support for the BOE corrosion groove is designed, so the graphical accurate control function of the graph mask is realized, moreover, an acetone groove and a hydrofluoric corrosion groove are added, integrated realization of the technology of the wet corrosion equipment graph substrate is further realized in the equipment, the manufacturing technology of the graph substrate is simplified, time is saved, and the process is shortened. According to the equipment, a solid base for the technology of graph substrates with large dimensions is established.

Description

Technical field [0001] The invention relates to the technical field of microelectronic mechanical equipment technology and pattern substrate preparation of semiconductor light-emitting materials. In particular, it relates to an integrated wet etching equipment for obtaining a pattern substrate by wet etching sapphire with a BOE solution. Background technique [0002] In recent years, issues such as environmental protection and pollution reduction have appeared frequently, and they have evolved from related institutions to issues of public concern to public participation and public construction. The high-tech products of environmental protection, energy saving and new energy have become the main areas leading the development of new international industries and opening up economic growth points in recent years. With the continuous development of semiconductor light-emitting materials, GaN (gallium nitride)-based light-emitting diodes (LEDs) have been invented this year. Its 10 ti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/306H01L21/311H01L21/673
CPCH01L21/67086H01L21/673
Inventor 孙永健杨海艳
Owner PEKING UNIV