Trenching resistance welding type IGBT module base plate

A bottom plate and solder resist technology, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of solder layer thinning, inability to realize molten solder diversion, accumulation, etc., to prevent insulation failure, improve insulation capacity and power Circulation ability, the effect of avoiding accumulation

Inactive Publication Date: 2015-02-11
XIAN YONGDIAN ELECTRIC
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AI Technical Summary

Problems solved by technology

Since the flow of solder after melting is random, there is no regularity to follow, and the solder resist coating cannot realize the diversion of the molten solder, but only plays

Method used

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  • Trenching resistance welding type IGBT module base plate
  • Trenching resistance welding type IGBT module base plate

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Embodiment Construction

[0023] The invention discloses a slotted and solder-resistant IGBT module bottom plate. Grooves are arranged on the edge of the welding area of ​​the slotted and solder-resistant IGBT module bottom plate. form a closed circle.

[0024] Preferably, in the above-mentioned slotted solder resist type IGBT module bottom plate, the shape of the groove is U-shaped or V-shaped.

[0025] Further, in the above-mentioned slotted solder resist type IGBT module bottom plate, the shape of the groove is V-shaped.

[0026] Preferably, in the above-mentioned slotted solder resist type IGBT module bottom plate, the depth of the groove is less than or equal to the designed solder thickness between the substrate and the module bottom plate.

[0027] Preferably, in the above-mentioned slotted solder resist type IGBT module bottom plate, the width of the upper end surface of the groove is less than or equal to 3 mm.

[0028] The invention also discloses an IGBT module, which includes a bottom pla...

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Abstract

A grooved solder mask insulated-gate bipolar transistor (IGBT) module base plate (1). A groove (2) is provided at the edge of a soldering region of the grooved solder mask IGBT module base plate (1). The inner-edge dimension of the groove (2) matches with the contour dimension of a solder substrate (4) and constitutes one closed ring. By designing a ring of grooved structure at the edge of the soldering region (3) of the module base plate to divert a molten solder that spilled over, the molten solder is evenly distributed within the defined soldering region, thus implementing the goal of preventing spillover of the molten solder, preventing deposition of the solder at the edge of a copper-plated ceramic substrate (a DBC substrate), ensuring the thickness of a solder layer, facilitating increased insulating capability and increased power cycling capability of the module, and preventing occurrences of module insulation failure and of cracking between the DBC substrate and the base plate.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a slotted and solder-resistant IGBT module bottom plate. Background technique [0002] Insulated Gate Bipolar Transistor (IGBT for short) has the performance characteristics of high frequency, high voltage, high current, especially easy to turn on and off, and is internationally recognized as the third revolution of power electronics technology. The most representative product has been developed to the sixth generation so far, and the commercialization has been developed to the fifth generation. [0003] The insulated gate bipolar transistor module is mainly used in the main circuit inverter of the frequency converter and all inverter circuits, that is, in DC / AC conversion. Today's new power electronic devices represented by IGBT modules are the core switching components of high-frequency power electronic circuits and control systems, and have been widely used in electric...

Claims

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Application Information

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IPC IPC(8): H01L23/488H01L29/739
CPCH01L23/488H01L29/739H01L2924/0002H01L2924/00
Inventor 王豹子
Owner XIAN YONGDIAN ELECTRIC
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