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Polyamide hot melt adhesive used in electronic packaging field

A polyamide hot-melt adhesive and electronic packaging technology, which is applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problem that the low-pressure injection molding process cannot be used, the viscosity of polyamide hot-melt adhesive is high, and it is inconvenient to apply to packaging Aspects and other issues, to achieve the effect of uniform sizing process, low injection pressure requirements, and moderate hardness

Inactive Publication Date: 2015-02-18
苏州雷立特新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If it is applied in packaging, the polyamide hot melt adhesive has relatively high viscosity and cannot be used in low-pressure injection molding process; and its low softening point is not convenient for application in packaging

Method used

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  • Polyamide hot melt adhesive used in electronic packaging field
  • Polyamide hot melt adhesive used in electronic packaging field
  • Polyamide hot melt adhesive used in electronic packaging field

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A polyamide hot melt adhesive used in the field of electronic packaging, prepared with the following components in parts by weight: 0.85mol Empol 1061, 0.15mol sebacic acid, 0.2mol 3,4 diaminodiphenyl ether, 0.1mol epoxy Resin, 1.5g antioxidant 1010, 0.80mol ethylenediamine and 0.02mol polyetheramine D-2000.

[0020] Preparation:

[0021] 0.85mol dimer acid Empol 1061 (purchased from BASF, Germany, 95% dimer acid content), 0.15mol sebacic acid, 0.2mol 3,4 diaminodiphenyl ether, 0.1mol epoxy resin Epiclon HP-4032D ( (Purchased from Japan DIC company), polyolefin 751 (purchased from Degussa, Germany) and 1.5 g of antioxidant 1010 were put into a 1000 ml three-necked flask, and the temperature was slowly raised under nitrogen protection until the raw materials in the flask were completely dissolved, and the temperature was maintained at 130°C. 0.80mol ethylenediamine and 0.02mol polyetheramine D-2000 were dropped into the reaction flask at this temperature. Finish the drip w...

Embodiment 2～6

[0023] According to the formula in Table 1, referring to the process of Example 1, polyamide hot melt adhesive particles were prepared. The properties of the polyamide hot melt adhesives prepared in Examples 1 to 6 were tested according to the following methods, and the test results are shown in Table 2 and Table 3.

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PUM

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Abstract

The invention discloses a polyamide hot melt adhesive used in an electronic packaging field. The polyamide hot melt adhesive is prepared from the following mixed components in parts by weight: 45-90 parts of unsaturated fatty acid dimmer, 5-20 parts of aliphatic dicarboxylic acid, 15-35 parts of diamine, 0.01-0.05 part of a catalyst, 1-5 parts of polyolefin, 1-5 parts of epoxy resin, 1-5 parts of a molecular weight blocking agent, 0.5-2 parts of an antioxidant and 0.01-0.1 part of a rheology control agent. According to the polyamide hot melt adhesive provided by the invention, the low temperature flexibility and high-temperature creep resistant performance are respectively improved, the polyamide hot melt adhesive has excellent low temperature resistance and is unlikely to be degraded after being heated; the polyamide hot melt adhesive has a high softening point, and has better fluidity under the high softening point, and the adhesive application process is uniform; the polyamide hot melt adhesive is high in bonding strength, has good bonding for metals and plastics, and has higher bonding capacity for polar PVC (polyvinyl chloride) materials; the polyamide hot melt adhesive is moderate in hardness and excellent in comprehensive performance.

Description

Technical field [0001] The invention relates to a polyamide hot melt adhesive used in the field of electronic packaging. Background technique [0002] There are two types of polyamide hot melt adhesives: one is high molecular weight polyamide hot melt adhesives (commonly known as nylon hot melt adhesives), which are mainly used in clothing, spinning and other industries; the other is low molecular weight polyamide hot melt adhesives ( It is often called dimer acid type polyamide hot melt adhesive), which is formed by polycondensation of dimer acid and diamine or polyamine. It has a narrow melting point, high softening point, non-toxic, good oil and chemical resistance, and excellent wear resistance. , It has high bonding strength to polar materials and good low temperature flexibility. It is widely used in electronic appliances, shoemaking, heat shrinkable tubing, automobiles and other fields. It is a recognized high-grade hot melt adhesive. [0003] Du Ying et al. used domestic l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/08C09J123/00C09J163/00C08G69/40C08G69/34
Inventor 杨凯华
Owner 苏州雷立特新材料科技有限公司
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