Micro-electromechanical systems (MEMS) device assembling technology

A process and device technology, applied in the field of MEMS device integration process, can solve the problems of reducing the performance and yield of fabricated devices, device failure, increasing power consumption, etc., to save device packaging volume, reduce failure probability, and improve yield. Effect

Active Publication Date: 2015-02-25
WUHAN XINXIN SEMICON MFG CO LTD
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  • Abstract
  • Description
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Problems solved by technology

[0003] figure 1 It is a structural schematic diagram of a traditional MEMS chip integrated package; such as figure 1 As shown, in the traditional MEMS chip integration process, in order to reduce the overall packaging area, the chip a is first stacked on the chip b, and after the interconnection between the chip a and the chip b is realized through the wire 11, Then carry out the final

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  • Micro-electromechanical systems (MEMS) device assembling technology
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[0036] In the following description, a lot of specific details are given in order to provide a more thorough understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features known in the art are not described.

[0037] It should be understood that the present invention can be implemented in different forms and should not be construed as being limited to the embodiments presented here. On the contrary, the provision of these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. In the drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals denote the same elements throughout.

[0038] It should be understood that when an...

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Abstract

The invention relates to a micro-electromechanical systems (MEMS) device assembling technology and relates to the field of semiconductor device manufacture. The MEMS device assembling technology realizes connection of a MEMS chip and other semiconductor chips by direct bonding of the MEMS chip and the other semiconductor chips, utilizes a through-silicon-vias technology to prepare interconnection lines thereby realizing connection of a bonding chip and an external device and reducing connection lines connecting the chips, reduces device failure probability, saves a device packaging volume, reduces device power consumption, improves bonding chip heat conditions, effectively improves device performances and greatly improves a product yield rate.

Description

technical field [0001] The invention relates to the field of semiconductor device manufacturing, in particular to a MEMS device integration process. Background technique [0002] At present, as the application fields of MEMS (Micro-electromechanical Systems, micro-electromechanical systems) chips become more and more extensive, it is necessary to integrate and package MEMS chips with other semiconductor chips; and in order to save the packaging area of ​​the overall device structure, usually The stacking method sets the MEMS chip on top of other chips. [0003] figure 1 It is a structural schematic diagram of a traditional MEMS chip integrated package; such as figure 1 As shown, in the traditional MEMS chip integration process, in order to reduce the overall packaging area, the chip a is first stacked on the chip b, and after the interconnection between the chip a and the chip b is realized through the wire 11, Then carry out the final packaging process; because the incre...

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Application Information

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IPC IPC(8): B81C3/00B81C1/00
Inventor 黄海何晓峰黄建冬
Owner WUHAN XINXIN SEMICON MFG CO LTD
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