Outline dicing and sheet picking method for ultrathin quartz substrate thin film circuit

Abstract

The invention discloses an outline dicing and sheet picking method for an ultrathin quartz substrate thin film circuit. The method comprises the following steps: providing an ultrathin quartz substrate, a small bearing substrate and a large bearing substrate forming an array circuit pattern; temporarily bonding the ultrathin quartz substrate (right side up) integrally with the small bearing substrate and the large bearing substrate from top to middle to bottom; cutting through the ultrathin quartz substrate to form an array circuit; separating the ultrathin quartz thin film circuit from the small bearing substrate and the large bearing substrate respectively; and picking up the ultrathin quartz thin film circuit, and performing cleaning and drying treatment. The method is easy to operate. Moreover, the circuit is complete in appearance and good in shape, and the yield is increased greatly.

Description

technical field [0001] The invention belongs to the technical field of millimeter-wave and sub-millimeter-wave integrated circuit manufacturing, and in particular relates to a shape cutting and picking method for thin-film circuits of ultra-thin quartz substrates. Background technique [0002] Quartz substrates are commonly used as circuit substrates for components in the terahertz frequency band. The material is high-purity isotropic fused silica. The reason is that the dielectric constant of quartz is relatively stable in the hundreds of GHz frequency band, and the loss is lower than that in the current microwave and millimeter wave frequency bands. The substrate material is also relatively stable in terms of thermal and mechanical properties. Quartz substrate thin film circuit patterns are usually prepared by large substrates and multi-units in the semiconductor integrated circuit process. The process includes: substrate cleaning, coating, photoetching, electroplating thi...

AI Technical Summary

Problems solved by technology

However, the automatic sheet unloading machine is currently only suitable for picking up the workpiece from the adhesive film through the steps of adhesive film expansion, film removal and vacuum adsorption after scribing, and is not suitable for the workpiece using an adhesive with high bond strength ( Such as glue, paraffin, etc.) bonded to the hard substrate and cut

Because the workpiece is directly bonded to the hard substrate with a high-strength adhesive, after cutting, it needs to be soaked in a special solvent to remove the adhesive. After cleaning, there is a small amount of residual solvent at the bottom of the container, which will separate the workpiece from the substrate. The air at the bottom of the container is drained, so that the two are in a near-vacuum state. Under the action of atmospheric pressure, when picking up workpieces such as quartz substrate thin film circuits with a thickness ≤ 50 μm, a plane width ≥ 100 μm, and a wide range of aspect ratios , the picking capacity is greatly limited, it is difficult to pick up the workpiece directly and effectively from the bottom of the cleaning container

At present, the most common method of picking chips is to use tweezers to pick them up manually, and using tweezers to pick up ultra-thin quartz thin film circuits is a hard contact, which will cause defects such as edge chipping, breakage, and scratches on the surface of the thin film circuit.

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