Inorganic packaging method for quantum dot-based white light LED devices

Abstract

The invention relates to an inorganic packaging method of a quantum-point-based white-light LED device. The inorganic packaging method is characterized in that the method comprises the following steps: step one, preparing inorganic silica sol; to be specific, adding ammoniacal liquor into a mixed solution with TEOS, H2O and glycerol, controlling the pH value of the solution to be between 9.5 to 10; after carrying out stirring fully, adding a few PVA water solution, and then carrying out stirring for 1.5 hours, carrying out filtering by using a piece of low-speed filter paper to obtain a granular silica micelle sol, and carrying out curing for one week at the temperature of 40 DEG C to obtain silica sol with high concentration; step two, carrying out inorganic packaging including die bonding, wire welding, dispensing, lens covering, and glue injection and solidification. According to the invention, with the method, the traditional epoxy resin and silica gel packaging methods can be improved conveniently and effectively; and the light transmittance of the white-light LED device can be improved beneficially. The manufacturing process is simple; the efficiency is high; the cost is low; and the quantum-point-based white-light LED device can be applied widely.

Description

technical field [0001] The invention relates to an inorganic packaging method of a white light LED device based on quantum dots; the method is beneficial to improving the light transmittance of the white light LED device, has simple manufacturing process, high efficiency and low cost, and makes the white light LED device based on quantum dots more widely used. Background technique [0002] As a new type of solid cold light source, white LED has the advantages of low threshold voltage, high brightness, long life, compact structure, small size, light weight, fast response and no radiation. It is called the fourth generation lighting source. The LED manufacturing process is generally divided into the front process (chip production) and the back process (packaging). Among them, the LED package will directly affect the performance and life of the LED. In order to realize the advantages of long life and high light efficiency of LED, more light must be extracted from the LED chip ...

AI Technical Summary

Problems solved by technology

Although epoxy resin has the advantages of good dielectric properties and adhesive properties, with the improvement of packaging requirements, epoxy resin has gradually shown disadvantages as a packaging material, such as large internal stress after curing, resistance to mechanical shock, and poor heat resistance. Wait

Similarly, as a packaging material, silica gel has the advantages of excellent shock absorption, cushioning, good heat resistance, and UV resistance. However, the performance of silica gel is greatly affected by the ambient temperature. As the temperature rises, the heat inside the silica gel Increased stress leads to a decrease in the refractive index of silica gel, which affects LED light efficiency and light intensity distribution

When using silica gel packaging, it needs to be cured at 150°C for ~2h, the quantum dots are easily damaged, and the quantum yield drops a lot

The light transmittance of organic silica gel is not very high, and the light cannot be emitted effectively, which will limit the application of quantum dots in white light LEDs