Three-dimensional integrated subminiature band-pass filter

A band-pass filter, three-dimensional integrated technology, applied in impedance networks, electrical components, multi-terminal-to-network, etc., can solve the problems of inability to meet the requirements of miniaturization, large low-frequency occupied volume, insufficient stop-band attenuation, etc. The effect of large out-of-band rejection, reduced volume, and increased out-of-band rejection

Inactive Publication Date: 2015-03-11
NANJING BOERTE ELECTRONICS TECH
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Problems solved by technology

[0004] At present, a lot of research has been done on bandpass filters at home and abroad. The low-frequency band occupies too much volume and the integration level is not high, which is far from m

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  • Three-dimensional integrated subminiature band-pass filter

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Embodiment Construction

[0015] In order to better understand the technical content of the present invention, specific embodiments are given together with the attached drawings for description as follows.

[0016] Aspects of the invention are described in this disclosure with reference to the accompanying drawings, which show a number of illustrated embodiments. Embodiments of the present disclosure are not necessarily intended to include all aspects of the invention. It should be understood that the various concepts and embodiments described above, as well as those concepts and embodiments described in more detail below, can be implemented in any of a number of ways, which should be the concepts and embodiments disclosed by the present invention and not Not limited to any implementation. In addition, some aspects of the present disclosure may be used alone or in any suitable combination with other aspects of the present disclosure.

[0017] like figure 1 As shown, according to the disclosure of th...

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Abstract

The invention provides a three-dimensional integrated subminiature band-pass filter which is realized by adopting a semi-lumped structure, and comprises an input/output port, four parallel resonant cells, an inter-stage coupling capacitor and a Z-shaped crossed coupling capacitor. According to the band-pass filter provided by the invention, interconnection between stages is realized by virtue of electromagnetic coupling among the resonant cells. By virtue of an LTCC (low temperature co-fired ceramic) laminating structure, an equivalent lumped parameter element is realized. Compared with the prior art, the three-dimensional integrated subminiature band-pass filter has the advantages of a small size, low cost, good frequency-selection characteristic, high temperature stability and small insertion loss, can be machined into a paster film, is convenient to integrate with other microwave assemblies and beneficial to mass production. The scheme adopted by the invention can be used for inhibiting out-of-band harmonic waves, and is applicable to occasions and corresponding systems with strict requirements on size, electrical performance, temperature stability and reliability, such as communication terminals of corresponding microwave millimeter wave frequency bands, digital radars and wireless communication hand-held terminals.

Description

technical field [0001] The invention relates to the technical field of power splitters, in particular to a three-dimensional integrated ultra-small bandpass filter. Background technique [0002] Nowadays, whether it is radar, electronic detection, electronic countermeasures, etc., or mobile phone communication, television, and remote control, it is necessary to distribute and process electronic signals, which requires the use of an important microwave passive device-filter. With the rapid development of miniaturization of mobile communication, satellite communication and national defense electronic systems, high performance, low cost and miniaturization have become the development direction of the microwave / radio frequency field, and the performance, size, reliability and cost of filters are all affected. put forward higher requirements. In some state-of-the-art national defense equipment, the frequency bands used are quite crowded now, so cutting-edge equipment such as sat...

Claims

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Application Information

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IPC IPC(8): H03H7/12
Inventor 戴永胜陈相治丛正华张晓明李永帅边洁平
Owner NANJING BOERTE ELECTRONICS TECH
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