Water soluble silver protective agent, preparation method thereof, chemical silvering method and surface silver plated workpiece

An electroless silver plating, water-soluble technology, applied in the field of electroless plating, can solve the problems of poor protection effect of silver protectant, reduced electroconductivity of the coating, easy oxidation on the surface of the silver layer, etc., achieves good electrical conductivity, prevents oxidation corrosion, and is resistant to Effect of Corrosive Ability

Active Publication Date: 2015-03-18
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention solves the technical problem that the protective effect of the silver protective agent in the prior art is ...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] (1) Dissolve each component in water according to the following proportions to prepare the water-soluble silver protective agent S1 of this example: 13wt% fatty alcohol polyoxyethylene ether; 4wt% benzotetrazole; 4wt% dodecanethiol %; Cyclododecane 3wt%; N-benzylphenylacetamide 4wt%, the remainder is water;

[0027] (2) Ultrasonic degreasing is carried out on the workpiece to be plated with copper plating on the surface. After washing with water, soak it in 5wt% sulfuric acid solution to remove the oxide layer. After washing, put it into the silver plating solution for chemical silver plating. The composition of the silver plating solution is: Silver methanesulfonate 0.1g / L, sodium citrate 0.2g / L, ethylenediamine 0.1 g / L, ceric sulfate 0.1ppm, benzotriazole 0.2ppm, sodium lauryl sulfate 5ppm, Pingpingjia 1ppm, use sodium hydroxide solution to adjust the pH value to 9.2; the temperature of the silver-plating solution is 52°C, and the silver-plating time is 10min; after t...

Embodiment 2

[0029] Adopt the steps identical with embodiment 1 to prepare water-soluble silver protective agent S2, and carry out electroless silver plating, difference is:

[0030] In step (1), the composition of the water-soluble silver protecting agent S2 is: fatty alcohol polyoxyethylene ether 14wt%; benzotetrazole 7wt%; dodecanethiol 6wt%; cyclododecane 5wt%; N-benzene Methylphenylacetamide 6wt%, the remainder is water;

[0031] In step (2), the conditions for the silver layer protection treatment include: the temperature of the water-soluble silver protection agent is 44° C., and the treatment time is 4 minutes.

[0032] Through the above steps, the plated part S20 of this embodiment is obtained.

Embodiment 3

[0034] Adopt the same step as embodiment 1 to prepare water-soluble silver protective agent S3, and carry out electroless silver plating, difference is:

[0035] In step (1), the composition of the water-soluble silver protecting agent S3 is: fatty alcohol polyoxyethylene ether 15wt%; benzotetrazole 9wt%; dodecanethiol 8wt%; cyclododecane 7wt%; N-benzene Methylphenylacetamide 9wt%, the remainder is water;

[0036] In step (2), the conditions for the silver layer protection treatment include: the temperature of the water-soluble silver protection agent is 40° C., and the treatment time is 2 minutes.

[0037] Through the above steps, the plated part S30 of this embodiment is obtained.

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PUM

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Abstract

The invention provides a water soluble silver protective agent and a preparation method thereof, wherein the water soluble silver protective agent is an aqueous solution containing fatty alcohol polyoxyethylene ether, N-benzyl phenylacetamide and a protective additive, and the protective additive is one or more substance selected from the group consisting of cyclododecane, 1-octadecene, 7-octadecene and 1-laurylene. The invention also provides a chemical silvering method and a surface silver plated workpiece obtained by the method, and the method comprises first chemical silvering and then silver layer protection treatment by use of the water soluble silver protective agent. The water soluble silver protective agent can form a protective film with a layer of organic molecular structure on the surface of the silver plating layer, direct exposure to air or other corrosive environment of the silver plating layer can be avoided, oxidation and corrosion of the silver plating layer can be prevented, the silver plating layer has better corrosion resistance, good conductivity of the silver plating layer can be ensured, and good metallic luster of the silver plating layer can be maintained.

Description

technical field [0001] The invention belongs to the field of chemical plating, and in particular relates to a water-soluble silver protecting agent and a preparation method thereof, a chemical silver plating method, and a surface silver-plated workpiece obtained by the chemical silver plating method. Background technique [0002] Silver plating has good electrical conductivity, thermal conductivity, solderability, stability, and reliable adhesion to the substrate, and the price of silver is much lower than other precious metals, such as gold and platinum. Therefore, metallic silver is used in electronics, It is widely used in communication, electrical and decoration industries, especially in electronic connectors, semiconductors, integrated circuit lead frames and printed circuit board industries, which often require silver plating. However, during the production, transportation, installation and use of the above-mentioned electronic components, the H in the environment 2 S...

Claims

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Application Information

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IPC IPC(8): C23C18/42
CPCC23C18/1689C23C18/42
Inventor 董有军连俊兰林宏业
Owner BYD CO LTD
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