Low-melting metal heat absorption solution

A low-melting-point metal and solution technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve problems such as damage to high-temperature objects or surrounding workpieces, hinder heat transfer between high-temperature objects and phase change materials, and damage to high-temperature objects. Enhance convective heat transfer and promote rapid heat absorption or release

Active Publication Date: 2015-03-25
BEIJING EMIKON TECH DEV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Common endothermic materials are organic phase change materials (such as paraffin), inorganic phase change materials (Na 2 SO 4 10H 2 O), composite phase change materials or water, most of these organic, inorganic and composite phase change materials are solid at room temperature, when used, they have high contact thermal resistance with high temperature objects, which not only hinders the contact between high temperature objects and phase change materials Realize rapid heat transfer between high-temperature objects and phase change materials only by heat conduction, and heat conduction is the slowest way of heat transfer in heat transfer; moreover, if the heat cannot be quickly transferred from the high-temperature object Passed to phase-change materials, high-temperature objects may be damaged
For water as an endothermic material, although its specific heat capacity is high, the boiling point of water is only 100 ° C, which limits the long-term work of water at lower temperatures.
When the temperature is high, water will vaporize, which may affect people's working environment, and may also cause damage to high-temperature objects or surrounding workpieces

Method used

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Examples

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Embodiment 1

[0033] Example 1 demonstrates a typical application of a low-melting-point metal endothermic solution of the present invention. figure 1 It is a schematic diagram of the components of a low-melting-point metal endothermic solution dispersion system in the embodiment, figure 2 It is a schematic diagram of the components of phase change microcapsules in a low melting point metal endothermic solution in the embodiment. Among them: 1 is a dispersion medium, 2 is a phase change microcapsule, 3 is a wall material, and 4 is a low melting point metal.

[0034] A kind of low melting point metal endothermic solution of the present embodiment, dispersion medium is water, the wall material of phase change microcapsule is polystyrene, and core material is bismuth indium tin alloy (alloy mass fraction is: Bi 32.5%, 51% In , 16.5% Sn), the melting point of bismuth indium tin alloy is 60°C. Phase change microcapsules are made by in-situ polymerization. The mass fraction of phase change mi...

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Abstract

The invention relates to a low-melting metal heat absorption solution. The low-melting metal heat absorption solution is characterized in that the solution is a homogeneous dispersion system, wherein the dispersion phase in the dispersion system is phase-change microcapsules; the dispersion medium is oil, water or alcohol; the phase-change microcapsules are produced in the way that the walls are made from high-molecular polymer and the core material is low-melting metal. The low-melting metal has relatively high phase-change hidden heat and thermal conductivity, so that the low-melting metal heat absorption solution can quickly absorb heat of high-temperature objects (liquids or solids) to enable the high-temperature objects to be quickly cooled down to reach the required temperature. The low-melting metal heat absorption solution is obvious in temperature reduction rate, and can be widely applied in the fields of temperature control, energy utilization, heat exchange and the like.

Description

technical field [0001] The invention provides a low-melting-point metal endothermic solution. The low-melting-point metal endothermic solution has an obvious cooling rate and can be widely used in the fields of temperature control, energy utilization, heat exchange and the like. Background technique [0002] Endothermic material refers to the material that absorbs the heat of the target high-temperature object, reduces the temperature of the high-temperature object, and raises its own temperature. Common endothermic materials are organic phase change materials (such as paraffin), inorganic phase change materials (Na 2 SO 4 10H 2 O), composite phase change materials or water, most of these organic, inorganic and composite phase change materials are solid at room temperature, when used, they have high contact thermal resistance with high temperature objects, which not only hinders the contact between high temperature objects and phase change materials Realize rapid heat tra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/06
CPCC09K5/06
Inventor 郭瑞
Owner BEIJING EMIKON TECH DEV
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