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Notebook computer case forming method

A notebook computer and molding method technology, which is applied in the field of notebook computer shell molding, can solve the problems of heavy notebook computer shell, inability to shield electromagnetic radiation, poor thermal conductivity, etc., and achieve low shrinkage, light weight, and good dimensional stability.

Inactive Publication Date: 2015-04-15
JIANGXI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, engineering plastic is the most commonly used material for notebook computer casings. It not only has the excellent heat resistance, dimensional stability and impact resistance of PC resin, but also has the excellent processing fluidity of ABS resin. It is used in thin-walled and It can maintain its excellent performance on products with complex shapes, but the manufactured notebook computer casing has the disadvantages of heavy weight, poor strength, poor thermal conductivity, etc., and cannot shield electromagnetic radiation

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A method for molding a notebook computer casing, the steps of which are:

[0020] (1) Make a molding mold according to the size of the computer shell, evenly coat the concave-convex model cavity surface and overflow groove of the molded mold with a release agent with a viscosity of 800mPa.s, and mix the epoxy resin and curing agent according to 3:1 , and inject it into the die cavity after uniform stirring, and the injection volume is half the height of the cavity;

[0021] (2) Lay the cut two-way carbon fiber blank into the cavity of the die, brush the carbon fiber cloth flat with a brush, soak it in epoxy resin, and then close the concave-convex film and place it in the thermocompression molding machine;

[0022] (3) Take out the molded shell, cut off the waste edge of the carbon fiber shell by means of extrusion, and then smooth the cut edge with fine sandpaper;

[0023] (4) After that, degrease and dust the surface of the carbon fiber shell with alcohol, and then a...

Embodiment 2

[0026] A method for molding a notebook computer casing, the steps of which are:

[0027] (1) Make a molding mold according to the size of the computer shell, evenly coat the concave-convex model cavity surface and overflow groove of the molded mold with a release agent with a viscosity of 1000mPa.s, and mix the epoxy resin and curing agent according to 3:1 , and inject it into the die cavity after uniform stirring, and the injection volume is half the height of the cavity;

[0028] (2) Lay the cut two-way carbon fiber blank into the cavity of the die, brush the carbon fiber cloth flat with a brush, soak it in epoxy resin, and then close the concave-convex film and place it in the thermocompression molding machine;

[0029] (3) Take out the molded shell, cut off the waste edge of the carbon fiber shell by means of extrusion, and then smooth the cut edge with fine sandpaper;

[0030] (4) After that, degrease and dust the surface of the carbon fiber shell with alcohol, and then ...

Embodiment 3

[0033] A method for molding a notebook computer casing, the steps of which are:

[0034] (1) Make a molding mold according to the size of the computer shell, evenly coat the concave-convex model cavity surface and overflow groove of the molded mold with a release agent with a viscosity of 1400mPa.s, and mix the epoxy resin and curing agent according to 3:1 , and inject it into the die cavity after uniform stirring, and the injection volume is half the height of the cavity;

[0035] (2) Lay the cut two-way carbon fiber blank into the cavity of the die, brush the carbon fiber cloth flat with a brush, soak it in epoxy resin, and then close the concave-convex film and place it in the thermocompression molding machine;

[0036] (3) Take out the molded shell, cut off the waste edge of the carbon fiber shell by means of extrusion, and then smooth the cut edge with fine sandpaper;

[0037] (4) Afterwards, degrease and dust the surface of the carbon fiber shell with alcohol, and then ...

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Abstract

The invention provides a notebook computer case forming method which is characterized in that carbon fibers are selected and used as main materials, have the performances of high strength, high temperature resistance, good friction resistance, good electric conductivity, good heat conductivity, good corrosion resistance and the like, are high in strength, small in internal stress and low in shrinkage after being cured by epoxy resin, and are high in dielectric performance, good in chemical stability and size stability and resistant to mould. A notebook computer case formed by compounding the continuous carbon fibers with the thermosetting epoxy resin has the advantages of being light in weight, thin in thickness, high in strength, good in heat resistance, high in heat dissipation speed and good in shielding property.

Description

technical field [0001] The invention relates to a notebook computer shell forming technology, in particular to a notebook computer shell forming method. Background technique [0002] At present, engineering plastic is the most commonly used material for notebook computer casings. It not only has the excellent heat resistance, dimensional stability and impact resistance of PC resin, but also has the excellent processing fluidity of ABS resin. It is used in thin-walled and Products with complex shapes can maintain its excellent performance, but the manufactured laptop casing has disadvantages such as heavy weight, poor strength, poor thermal conductivity, and cannot shield electromagnetic radiation. [0003] Carbon fiber has high strength, high temperature resistance, friction resistance, electrical conductivity, thermal conductivity and corrosion resistance. After curing, epoxy resin has high strength, small internal stress and low shrinkage. At the same time, it has high die...

Claims

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Application Information

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IPC IPC(8): B29C70/34B29C70/54
CPCB29C70/34B29C33/62B29C70/54B29C70/545
Inventor 胡剑锋
Owner JIANGXI UNIV OF TECH
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