Resourceful comprehensive utilization method of waste printed circuit boards

A printed circuit board and resource-based technology, applied in the field of comprehensive utilization of resources, can solve problems such as harsh operating environment, high local temperature, and high environmental protection requirements, and achieve the effects of solving environmental pollution, realizing industrialization, and simple process

Active Publication Date: 2015-04-22
清远市东江环保技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the heating of solder liquid to remove components has been cited by enterprises, but it is a manual mode, and its operating environment is harsh; there are no reports of industrialization of other liquid media.
Another method is to use air or gas as the heat transfer medium for heating. The disadvantage is that the temperature distribution during heating is uneven, resulting in excessive local temperature, coking of the circuit board solution, and generation of toxic gases.
[0005] After the components are removed, pyrolysis and cracking methods are used, which have high environmental protection requirements and high equipment requirements. However, there is no economical and environmentally friendly pyrotechnic industrialization at present. Therefore, a green, environmentally friendly, economical and effective It is imperative to have a high recovery rate of valence metals and an industrialized waste circuit board treatment process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Centrifugal rotating heating equipment is used to remove the components on the discarded circuit boards and recover them into solder, components and substrates respectively. The solder is packaged and sold directly, and the components are tested according to relevant standards and sold separately. If the components fail to meet the standards, they may be broken together with the substrate. The substrate is firstly crushed by impact shearing, and the particle size is below 20mm. After secondary crushing, the particle size is below 3mm. The crushed substrate and components are magnetically separated to separate ferrous materials and non-ferrous materials. Materials, after the non-ferrous materials are sorted by eddy current to separate aluminum, they enter the three-stage fine grinding of the hammer mill to make the particle size below 0.6mm, and the finely ground materials enter the high-voltage electrostatic separator to separate the metal materials and non-ferrous mater...

Embodiment 2

[0051] Centrifugal rotating heating equipment is used to remove the components on the discarded circuit boards and recover them into solder, components and substrates respectively. The solder is packaged and sold directly, and the components are tested according to relevant standards and sold separately. If the components fail to meet the standards, they may be broken together with the substrate. The substrate is firstly crushed by impact shearing, and the particle size is below 20mm. After secondary crushing, the particle size is below 3mm. At this time, the magnetic substance (Fe) is separated from the non-magnetic substance by a magnetic separator, and the iron is separated. Iron and non-ferrous materials, non-ferrous materials are separated by eddy current separation to remove aluminum, and after removing iron and aluminum, the materials are subjected to three-stage fine grinding by a hammer mill to less than 0.6mm, and finally two-stage high-voltage electrostatic separatio...

Embodiment 3

[0076] Centrifugal rotating heating equipment is used to remove the components on the discarded circuit boards and recover them into solder, components and substrates respectively. The solder is packaged and sold directly, and the components are tested according to relevant standards and sold separately. If the components fail to meet the standards, they may be broken together with the substrate. The substrate is firstly crushed by impact shearing, and the crushing particle size is below 20mm. After secondary crushing, the particle size is below 3mm. At this time, the magnetic material (Fe) and the non-magnetic material are separated by a magnetic separator to obtain iron materials. And non-ferrous materials, for non-ferrous materials, remove aluminum by eddy current separation, then carry out three-stage fine grinding to less than 0.6mm by hammer mill, and finally obtain metal materials containing about 82.9% copper by two-stage high-voltage electrostatic separation , and non...

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Abstract

The invention discloses a resourceful comprehensive utilization method of waste printed circuit boards. The method comprises the following steps: crushing waste printed circuit boards and carrying out magnetic separation to obtain ferrous raw materials and non-ferrous raw materials; carrying out high-voltage electrostatic separation on the non-ferrous raw materials to obtain metallic materials and non-metallic materials; and separating such metals as copper, gold and silver from the metallic materials. By adopting the method disclosed by the invention, such valuable metals as copper, tin, aluminum, iron, lead, gold and silver and metal slag containing nickel and zinc in the waste printed circuit boards can be recovered and the materials such as non-metallic resin can also be recovered. By adopting the resourceful comprehensive utilization method, the problems of environmental pollution caused by the waste printed circuit boards and the like are solved and the resourceful comprehensive utilization of the waste printed circuit boards is achieved. The method is simple in process and is economical and practical and industrialization is easy to implement.

Description

technical field [0001] The invention relates to the field of comprehensive resource utilization, and more specifically relates to a method for resource comprehensive utilization of waste printed circuit boards. Background technique [0002] There are two main sources of waste printed circuit boards, one is the circuit boards contained in discarded electronic appliances, and the other is the scraps and scraps formed during the production process of printed circuit boards. From computers, TVs, mobile phones to electronic toys, almost all electronic and electrical products contain printed circuit boards. Therefore, once electronic and electrical products are discarded, a large number of waste printed circuit boards will be produced. At present, the elimination of electronic and electrical products is getting faster and faster, such as TVs, refrigerators, washing machines, air conditioners, personal computers, mobile phones, game consoles, radios and some smart electronic produc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22B7/00C22B15/00C22B11/00C22B13/00C22B25/00
CPCY02P10/20
Inventor 万艳鹏黄博朱泽伟
Owner 清远市东江环保技术有限公司
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