A kind of preparation method of gold jewelry
A jewelry and gold technology, which is applied in metal processing equipment, clothing, decorative chains, etc., can solve the problem that gold jewelry with a chain link structure cannot be prepared at one time
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0017] The preparation method of gold ornament provided by the invention comprises the following steps:
[0018] (1) make a metal mandrel with a link structure, the metal mandrel is a tin-bismuth alloy and / or a lead-bismuth alloy; based on the total weight of the tin-bismuth alloy, the amount of tin in the tin-bismuth alloy The content is 40-60% by weight, and the content of bismuth is 40-60% by weight; based on the total weight of the lead-bismuth alloy, the content of lead in the lead-bismuth alloy is 40-50% by weight, and the content of bismuth is 50-60% by weight;
[0019] (2) electroplating the first copper layer, the gold layer, the second copper layer and the nickel layer sequentially on the metal mandrel;
[0020] (3) Form a hole through all the plating layers to the metal mandrel, then melt the metal mandrel and drain through the hole, then remove the first copper layer, second copper layer and nickel layer.
[0021] The metal mandrel mainly plays the role of a form...
Embodiment 1
[0037] This embodiment is used to illustrate the preparation method of the gold ornament provided by the present invention.
[0038] Inject the tin-bismuth alloy of molten state (based on the total weight of the tin-bismuth alloy, the content of tin is 40% by weight, and the content of bismuth is 60% by weight) in the silicone rubber mold with chain link structure, then cooling , forming a metal mandrel with a link structure. The metal mandrel is then placed in a drum to remove thorns or any parting lines and then cleaned in an ultrasonic cleaning solution. The cleaned metal mandrel is transferred to the barrel plating equipment containing copper electroplating solution (the mixture of copper sulfate of 200g / L and the sulfuric acid of 70g / L, the same below) for barrel plating, wherein the barrel plating conditions include The immersion depth of the drum in the copper-containing electroplating solution is 30% of the diameter of the drum, and the rotating speed of the drum is 1...
Embodiment 2
[0040] This embodiment is used to illustrate the preparation method of the gold ornament provided by the present invention.
[0041] Inject the tin-bismuth alloy of molten state (based on the total weight of the tin-bismuth alloy, the content of tin is 45% by weight, and the content of bismuth is 55% by weight) in the silicone rubber mold with chain link structure, then cooling , forming a metal mandrel with a link structure. The metal mandrel is then placed in a drum to remove thorns or any parting lines and then cleaned in an ultrasonic cleaning solution. The cleaned metal mandrel is transferred to barrel plating equipment containing copper-containing electroplating solution, wherein the barrel plating conditions include that the depth of immersion of the cylinder in the copper-containing electroplating solution is 40% of the diameter of the cylinder, and the rotation speed of the cylinder is 14r / min to form the first copper layer with a thickness of 58 microns. Then the c...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 