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A kind of preparation method of gold jewelry

A jewelry and gold technology, which is applied in metal processing equipment, clothing, decorative chains, etc., can solve the problem that gold jewelry with a chain link structure cannot be prepared at one time

Active Publication Date: 2015-11-18
SHENZHEN UNITED BLUEOCEAN TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the defect that the existing method cannot be used to prepare gold ornaments with a chain link structure at one time, and to provide a method for preparing gold ornaments with a chain link structure at one time.

Method used

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  • A kind of preparation method of gold jewelry
  • A kind of preparation method of gold jewelry

Examples

Experimental program
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Effect test

preparation example Construction

[0017] The preparation method of gold ornament provided by the invention comprises the following steps:

[0018] (1) make a metal mandrel with a link structure, the metal mandrel is a tin-bismuth alloy and / or a lead-bismuth alloy; based on the total weight of the tin-bismuth alloy, the amount of tin in the tin-bismuth alloy The content is 40-60% by weight, and the content of bismuth is 40-60% by weight; based on the total weight of the lead-bismuth alloy, the content of lead in the lead-bismuth alloy is 40-50% by weight, and the content of bismuth is 50-60% by weight;

[0019] (2) electroplating the first copper layer, the gold layer, the second copper layer and the nickel layer sequentially on the metal mandrel;

[0020] (3) Form a hole through all the plating layers to the metal mandrel, then melt the metal mandrel and drain through the hole, then remove the first copper layer, second copper layer and nickel layer.

[0021] The metal mandrel mainly plays the role of a form...

Embodiment 1

[0037] This embodiment is used to illustrate the preparation method of the gold ornament provided by the present invention.

[0038] Inject the tin-bismuth alloy of molten state (based on the total weight of the tin-bismuth alloy, the content of tin is 40% by weight, and the content of bismuth is 60% by weight) in the silicone rubber mold with chain link structure, then cooling , forming a metal mandrel with a link structure. The metal mandrel is then placed in a drum to remove thorns or any parting lines and then cleaned in an ultrasonic cleaning solution. The cleaned metal mandrel is transferred to the barrel plating equipment containing copper electroplating solution (the mixture of copper sulfate of 200g / L and the sulfuric acid of 70g / L, the same below) for barrel plating, wherein the barrel plating conditions include The immersion depth of the drum in the copper-containing electroplating solution is 30% of the diameter of the drum, and the rotating speed of the drum is 1...

Embodiment 2

[0040] This embodiment is used to illustrate the preparation method of the gold ornament provided by the present invention.

[0041] Inject the tin-bismuth alloy of molten state (based on the total weight of the tin-bismuth alloy, the content of tin is 45% by weight, and the content of bismuth is 55% by weight) in the silicone rubber mold with chain link structure, then cooling , forming a metal mandrel with a link structure. The metal mandrel is then placed in a drum to remove thorns or any parting lines and then cleaned in an ultrasonic cleaning solution. The cleaned metal mandrel is transferred to barrel plating equipment containing copper-containing electroplating solution, wherein the barrel plating conditions include that the depth of immersion of the cylinder in the copper-containing electroplating solution is 40% of the diameter of the cylinder, and the rotation speed of the cylinder is 14r / min to form the first copper layer with a thickness of 58 microns. Then the c...

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Abstract

The invention provides a preparation method of gold ornaments. The method comprises the following steps: (1) producing a metal core model with a chain knot structure, wherein the metal core model is made of tin-bismuth alloy and / or lead-bismuth alloy; and the tin-bismuth alloy comprises the following elements in percentage by weight: 40-60% of tin, and 40-60% of bismuth on the basis of the total weight of the tin-bismuth alloy; and lead-bismuth alloy comprises the following elements in percentage by weight: 40-50% of lead, and 50-60% of bismuth on the basis of the total weight of the lead-bismuth alloy; (2) sequentially electroplating a first copper layer, a gold layer, a second copper layer and a nickel layer on the metal core model; and (3) forming a hole passing through the electroplating layers to reach the metal core model, fusing the metal core model and discharging through the hole, and then removing the first copper layer, the second copper layer and the nickel layer. The gold ornament with the chain knot structure can be prepared at a time by adopting the method.

Description

technical field [0001] The invention relates to a preparation method of a gold ornament with a link structure. Background technique [0002] Gold jewelry includes gold jewelry without a chain link structure (such as most pendants, earrings, rings, etc.) and gold jewelry with a chain link structure (such as some bracelets, necklaces, etc.). Among them, such as figure 1 As shown, having a link structure means that there is an interlocking structure in the gold jewelry. At present, the preparation method of gold ornaments usually includes firstly making a core mold, and then electroplating a gold layer on the core mold. Wherein, the mandrel is usually a low-temperature waxy material, including beeswax, mineral wax (such as montan wax, ozokerite, paraffin wax), petroleum wax and the like. However, the low-temperature wax material mandrel is only suitable for the preparation of gold ornaments without a chain link structure, and for gold ornaments with a chain link structure, t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A44C27/00A44C11/00B22C9/04C22C13/02C22C12/00
Inventor 李志刚邓川
Owner SHENZHEN UNITED BLUEOCEAN TECH DEV