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Filler composition and application thereof

A technology of composition and resin composition, applied in circuit substrate materials, synthetic resin layered products, layered products, etc., can solve the problems of narrow use range, high production cost, high cost of spherical silicon micropowder, and improve fluidity. , the effect of increasing liquidity

Active Publication Date: 2015-04-29
GUANGDONG SHENGYI SCI TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method is limited to spherical silica below 5 μm, its use range is narrow, and the cost of spherical silica powder is high
[0005] Aiming at the problem of the above-mentioned narrow use range of spherical silica, there are currently some relevant literatures that use the compounding of two or more fillers with different particle sizes to expand the use range. Chinese patent CN101696317A uses spherical silica with different particle sizes Silica powder with a median particle size of 5-20 μm is obtained by preparing silica powder. However, the production cost is still high due to the expensive spherical silica powder used.

Method used

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  • Filler composition and application thereof
  • Filler composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-5

[0048] Angular silica and spherical silica with different particle size distributions were prepared, and the particle size distribution, specific surface area and peak number of particle size distribution are shown in Table 1. Use vinyl silane coupling agent (Shin-Etsu Chemical, product name KBM1003) to carry out surface treatment to silicon dioxide (self-preparation), the consumption of this surface treatment agent is 1% of siliceous fine powder filler weight, then add methyl ethyl ketone solution , after high-speed grinding, a filler composition with a solid content of 70% is prepared.

[0049] The following test methods were used to test and evaluate the fluidity, viscosity and stability of the obtained filler composition, and the results are shown in Table 1.

Embodiment 6-10

[0054] With 100 parts by weight of brominated bisphenol A type epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530), 24 parts by weight of novolak resin (Japan Qunrong, hydroxyl equivalent 105, product name TD2090), 0.05 parts by weight of 2-methylimidazole, add respectively the self-made filler composition among the embodiment 1-5, place in butanone solvent, mechanical stirring, emulsification are formulated into the filler content of embodiment 6-10 is 30wt % (based on resin), glue with a solid content of 65wt%, then impregnated with glass fiber cloth, heated and dried to form a prepreg, placed copper foil on both sides, pressurized and heated to form a copper clad laminate.

[0055] The following test methods were used to test and evaluate the coefficient of thermal expansion (CTE), interlayer adhesion and dispersion of the obtained copper-clad laminate, and the results are shown in Table 3.

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Abstract

The invention relates to a filler composition and application thereof. The filler composition comprises a spherical siliceous micro powder filler and an angular siliceous micro powder filler, and can be used for preparing a copper clad laminate substrate and bonding sheet resin composition. The filler composition is formed by compounding the angular siliceous micro powder filler and the spherical siliceous micro powder filler, which have specific particle size distribution, the flowability of the composition and the sedimentary stability in a solution or resin system can be improved, the thickness uniformity and the component uniformity of the copper clad laminate substrate are improved, and not only the sagging and gummosis problems are solved, but also the production cost is reduced greatly.

Description

technical field [0001] The invention relates to the technical field of laminated boards, in particular to a filler composition, in particular to a filler composition for a printed circuit board and a prepreg made thereof, a laminated board and a printed circuit board. Background technique [0002] Under the ever-changing trend of electronic technology, integrated circuits are developing rapidly in the direction of ultra-large-scale, high-frequency, high-speed, high-density, high-power, high-precision, and multi-functional. Therefore, the requirements for copper clad laminates are also getting higher and higher. Especially now the requirements for data transmission speed and transmission frequency are getting higher and higher, which put forward higher requirements for plate thickness uniformity and composition uniformity. [0003] In order to obtain a higher filling rate, spherical fillers are usually added, because spherical fillers have low viscosity and are easy to add, e...

Claims

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Application Information

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IPC IPC(8): C08K9/06C08K7/18C08K7/00C08K3/36C08L63/00C08L61/06B32B27/04B32B27/38B32B27/42H05K1/03
Inventor 杜翠鸣
Owner GUANGDONG SHENGYI SCI TECH
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