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Preparation method of novel chip-type oxygen sensor

A technology of oxygen sensor and sensor substrate, which is applied in the field of sensors, can solve the problems of affecting sensor signal, leakage of heating circuit, increasing the cost of oxygen sensor, etc., and achieve the effect of reducing production cost and increasing insulation performance

Inactive Publication Date: 2015-04-29
KUNSHAN SENSONOR SENSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This production method must use Pt resistance paste to make the heating resistor, thus increasing the cost of the oxygen sensor, and due to the thickness of the insulating layer of alumina printing or poor printing quality, it often causes leakage of the heating circuit and affects the signal of the sensor

Method used

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  • Preparation method of novel chip-type oxygen sensor
  • Preparation method of novel chip-type oxygen sensor

Examples

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preparation example Construction

[0025] The present invention provides a kind of preparation method of novel chip sensor, comprises the following steps:

[0026] (1) Make a casting sheet with oxide-doped zirconia powder as the sensor substrate, print the external electrode Pt and the internal electrode Pt on the upper and lower sides of the sensor substrate, and print a porous protective layer on the top of the external electrode and then dry it , sintering to obtain a sensitive layer;

[0027] (2) Mix aluminum oxide powder with silicon oxide powder or magnesium oxide powder, add 8% PVB, 5% triethanolamine, 5% polyethylene glycol, 40% absolute ethanol and 32% butanone, after 24 hours After ball milling, it is cast into a ceramic sheet with a thickness of 0.3mm, and then cut into a sheet with grooves and a sheet without grooves, which are laminated to form a reference substrate and then sintered. The formed reference substrate has a cavity, and the cavity The length matches the reference base body and opens o...

Embodiment 1

[0039] ① Make a sensitive layer

[0040] 2~8mole%Y 2 o 3Put 100g of doped zirconia powder in a ball mill, add 150g of ethanol, 5g of triethanolamine, 2g of glycerin, and 7g of polyvinyl alcohol, and mix for 35 hours to prepare a slurry with a viscosity of 5400mPa.s in a casting machine. The casting sheet with a thickness of 0.1-0.5mm is used as the sensor substrate, and then the outer electrode and the inner electrode are printed on both sides of the sensor substrate with platinum electrode paste, and then a porous protective layer is printed on the outer electrode, and after drying at 60-400°C , Sintered at 1350-1550°C.

[0041] ②Make a reference matrix

[0042] Mix aluminum oxide powder with 1-5wt% silicon oxide powder or magnesium oxide powder, add 8% PVB, 5% triethanolamine, 5% polyethylene glycol, 40% absolute ethanol and 32% methyl ethyl ketone, after 24 After being ball-milled for hours, it was cast into cast sheets with a thickness of 0.3-0.5mm, and then three of t...

Embodiment 2

[0047] Others are the same as in Example 1, except that the zirconia powder used to make the sensor matrix is ​​doped with 2-8 mole% of MgO; when making the reference matrix, the content of silicon oxide or magnesium oxide powder is 5wt%, and the The thickness of the cavity is 1mm, and the thickness of the concave cavity is 0.1mm.

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Abstract

The invention discloses a preparation method of a novel chip-type oxygen sensor. The preparation method comprises the following steps: manufacturing a zirconium oxide sensor matrix, printing an outer electrode Pt and an inner electrode Pt on the upper surface and the lower surface of the zirconium oxide sensor matrix, printing a porous protection layer on the outer electrode, drying and sintering; manufacturing a reference matrix by mixing aluminum oxide powder and silicon oxide or magnesium oxide powder, manufacturing a recessed cavity which is used as an air channel on the reference matrix and sintering; printing tungsten resistance paste on the bottom surface of the reference matrix, printing aluminum oxide paste on the surface of a heating electrode, drying and sintering; covering the reference matrix with a sensitive layer, coating high-temperature ceramic glaze between the sensitive layer and the reference matrix and sintering. According to the preparation method of the novel chip-type oxygen sensor, the structure of the chip-type oxygen sensor is simplified, the production cost is reduced and the insulating property between the heating electrode and the sensitive layer is improved ,so that the property of the chip-type oxygen sensor is improved.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a preparation method of a novel chip oxygen sensor. Background technique [0002] Because the chip oxygen sensor has fast heating time and high response speed, it is widely used in combustion control, safety control and industrial process control, especially in automobile engine combustion control and exhaust emission control system. Chip sensors generally integrate the sensitive layer and heating layer of the sensor made of zirconia material into the same small ceramic chip body. In order to facilitate co-sintering, the heating part is usually made of the same zirconia material as the sensor part. There is also a reference air channel layer and an insulating layer between the heating layer and the insulating layer. First, the insulating paste (generally made by adding an appropriate amount of sintering aid to the alumina material or alumina) is printed on the zirconia substrate,...

Claims

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Application Information

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IPC IPC(8): G01N27/409G01N27/00
Inventor 朱捷肖建中
Owner KUNSHAN SENSONOR SENSING TECH
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