Inverted organic electroluminescence device and preparation method thereof
An electroluminescent device, an inverted technology, which is applied in the fields of electro-solid devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of difficult to improve light efficiency, high work function, and unfavorable electron injection of inverted structure devices.
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[0045] like figure 2 As shown, the preparation method of an inverted organic electroluminescent device in one embodiment includes the following steps:
[0046] Step S310: providing a cathode substrate.
[0047] Wherein, the cathode substrate can be transparent conductive glass commonly used in this field, preferably indium tin oxide conductive glass (ITO), aluminum zinc oxide conductive glass (AZO) or indium zinc oxide conductive glass (IZO); more preferably indium Tin oxide glass (ITO); and the sheet resistance of the indium tin oxide conductive glass is 5Ω / □˜100Ω / □.
[0048] Step S320: preparing a P-type semiconductor layer by vacuum electron beam evaporation on the cathode substrate, and preparing an N-type semiconductor layer by vacuum electron beam evaporation on the P-type semiconductor layer to obtain a PN layer. Among them, the material of the P-type semiconductor layer is nickel oxide (NiO) or copper oxide (CuO), and the material of the N-type semiconductor layer i...
Embodiment 1
[0064] The structure of the inverted organic electroluminescence device of the present embodiment is: ITO / NiO / ZnO / Bphen / NPB:Ir(MDQ) 2 (acac) / NPB / Ag.
[0065] The preparation of the inverted organic electroluminescence device of this embodiment is as follows:
[0066] (1) Provide and clean the ITO cathode substrate, wherein the square resistance of the ITO cathode substrate is 5Ω / □, and the ITO cathode substrate is expressed as: ITO.
[0067] (2) Form a PN layer on the cathode substrate: in a vacuum of 1×10 -5 In Pa's vacuum coating system, electron beam evaporation technology is used to prepare a P-type semiconductor layer on the ITO cathode substrate. The thickness of the P-type semiconductor layer is 2nm, the material is nickel oxide (NiO), and the evaporation rate is 0.01nm / s , the P-type semiconductor layer is expressed as: NiO; and then the N-type semiconductor layer is prepared on the P-type semiconductor layer by electron beam evaporation technology, wherein the thick...
Embodiment 2
[0074] The structure of the inverted organic electroluminescent device of this embodiment is: ITO / CuO / SnO 2 / TPBi / Alq 3 :DCJTB / MeO-TPD / Al.
[0075] The preparation of the inverted organic electroluminescence device of this embodiment is as follows:
[0076] (1) Provide and clean the ITO cathode substrate, wherein the square resistance of the ITO cathode substrate is 100Ω / □, and the ITO cathode substrate is expressed as: ITO.
[0077] (2) Form a PN layer on the cathode substrate: in a vacuum of 1×10 -3 In Pa's vacuum coating system, electron beam evaporation technology is used to prepare a P-type semiconductor layer on the ITO cathode substrate. The thickness of the P-type semiconductor layer is 10nm, the material is copper oxide (CuO), and the evaporation rate is 0.1nm / s , the P-type semiconductor layer is expressed as: CuO; and then an N-type semiconductor layer is prepared on the P-type semiconductor layer by electron beam evaporation technology, wherein, the thickness of...
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